Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak

Yuheng Wu; Huachuang Wang

doi:10.1117/12.2242713

25 October 2016 Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak

Yuheng Wu, Huachuang Wang

Proceedings Volume 9686, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices; 968613 (2016) https://doi.org/10.1117/12.2242713
Event: Eighth International Symposium on Advanced Optical Manufacturing and Testing Technology (AOMATT2016), 2016, Suzhou, China

Abstract

In the use of image sensors such as CCD, CMOS and so on, the noise caused by thermal dark signal will influence the imaging results to a certain extent. Dark current noise exists in every photoelectric devices and it is directly related to the temperature. So it’s a principle way that cool the image sensors’ temperature to suppress the dark current noise. This article presents a kind of TEC cooling package integrated with four stages TEC, a heat sink and an insulating cavity, to meet the requirement of image sensors’ refrigeration. Theoretical analysis of this cooling package was done from the view of heat transfer. The modeling and thermal simulated analysis are performed by finite element simulation analysis software ANSYS Icepak, comparing the experimental results in the conditions of different ambient temperature, different heat load and vacuumizing or filling the cavity.

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Yuheng Wu and Huachuang Wang "Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak", Proc. SPIE 9686, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices, 968613 (25 October 2016); https://doi.org/10.1117/12.2242713

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KEYWORDS

Image sensors

Sensors

Thermoelectric materials

Image analysis

Electronics

Krypton

Resistance

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