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1 April 2022 Wafer-scale production of membrane-external-cavity surface-emitting laser (MECSEL) gain chips
Garrett D. Cole, David Follman, Catherine Nguyen, Roman Bek, Michael Zimmer, Norbert Witz
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Proceedings Volume PC11984, Vertical External Cavity Surface Emitting Lasers (VECSELs) XI; PC1198404 (2022) https://doi.org/10.1117/12.2609904
Event: SPIE LASE, 2022, San Francisco, California, United States
Abstract
Membrane-external-cavity surface-emitting lasers (MECSELs) consist of an epitaxial active region directly bonded to at least one transparent heatspreader with external cavity mirrors for feedback. This structure enables significant flexibility in the emission wavelength and yields a standalone laser gain medium amenable to enhanced power scaling via optimized thermal management. We outline a 4” wafer-scale manufacturing process for dual-SiC-heatspreader (SiC/epi/SiC) gain chips, incorporating external dielectric coatings and metallization for intimate mounting to a heatsink. Our process leverages low-temperature wafer bonding in concert with traditional deposition, lithography, and etching steps, allows hundreds of MECSEL gain chips to be simultaneously produced.
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Garrett D. Cole, David Follman, Catherine Nguyen, Roman Bek, Michael Zimmer, and Norbert Witz "Wafer-scale production of membrane-external-cavity surface-emitting laser (MECSEL) gain chips", Proc. SPIE PC11984, Vertical External Cavity Surface Emitting Lasers (VECSELs) XI, PC1198404 (1 April 2022); https://doi.org/10.1117/12.2609904
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KEYWORDS
Laser optics
Wafer-level optics
Manufacturing
Microfabrication
Mirrors
Quantum dots
Semiconductor lasers
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