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9 March 2023 Towards high-volume manufacturing of optoelectronic glass substrates for co-packaged optics
Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Juergen Matthies, Jeffrey S. Clark, Daniel W. Levesque, Kristopher A. Wieland
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Proceedings Volume PC12427, Optical Interconnects XXIII; PC1242707 (2023) https://doi.org/10.1117/12.2651387
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
Co-packaged optical modules aim to meet the increasing bandwidth and power reduction requirements in next-generation datacenter switches. Meeting the cost per capacity targets requires new and innovative wafer-scale manufacturing solutions. In this work, glass with low-loss (<0.1 dB/cm) single-mode ion-exchanged waveguides is proposed as an optoelectronic substrate for co-packaged optics. High-speed ultrafast laser processes are developed to fabricate through glass vias for electrical connections, ablated features to enable passive alignment of MPO-connector to chip coupling, and for the singulation of glass wafers into individual optical circuits with optical quality end-facets for low-loss edge coupling without subsequent post-polishing or finishing steps.
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Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Juergen Matthies, Jeffrey S. Clark, Daniel W. Levesque, and Kristopher A. Wieland "Towards high-volume manufacturing of optoelectronic glass substrates for co-packaged optics", Proc. SPIE PC12427, Optical Interconnects XXIII, PC1242707 (9 March 2023); https://doi.org/10.1117/12.2651387
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KEYWORDS
Glasses
Optics manufacturing
High volume manufacturing
Integrated optics
Optoelectronics
Wafer-level optics
Packaging
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