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Heterogeneous Integration is one “More-than-Moore” strategy that can help continue the trend towards overall electronics system scaling and cost reduction. Heterogeneous Integration involves high-efficiency and high-density interconnection of multiple chiplets and/or dies using advanced packaging technologies to provide communication bandwidth beyond what can be accomplished through circuit scaling alone.
This paper introduces the FPA-5520iV and FPA-8000iW steppers that are designed to meet the requirements of sub-micron Heterogeneous Integration applications. Topics include warped substrate handling, panel substrate processing, die-by-die overlay of highly distorted substrates, high-fidelity imaging across large exposure fields and high-accuracy stitching for exposure fields larger than 1 reticle.
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