Presentation
3 October 2024 Heterogeneous integration of telecom c-band emitting quantum dots on silicon photonics platform by adhesive bonding
Ponraj Vijayan, Fiona Braun, Michael Hack, Micha Seidel, Stephanie Bauer, Simone Luca Portalupi, Michael Jetter, Peter Michler
Author Affiliations +
Abstract
Silicon photonics for telecommunication applications has garnered much attention recently. The optical transparency and the large refractive index contrast of silicon in the telecommunication wavelengths allow the implementation of high-density photonic integrated circuits. The drawback of silicon photonics is that there is no native efficient light source. Integration of III-V material, which offers outstanding optical emission properties, on silicon provides a potential solution. One of the approaches for large-scale integration is through heterogeneous integration of a III-V membrane using adhesive bonding. Here, we will report on the integration of telecom C-band emitting InAs QDs on a silicon platform through such bonding.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ponraj Vijayan, Fiona Braun, Michael Hack, Micha Seidel, Stephanie Bauer, Simone Luca Portalupi, Michael Jetter, and Peter Michler "Heterogeneous integration of telecom c-band emitting quantum dots on silicon photonics platform by adhesive bonding", Proc. SPIE PC13109, Metamaterials, Metadevices, and Metasystems 2024, PC131090S (3 October 2024); https://doi.org/10.1117/12.3027061
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KEYWORDS
Silicon

Silicon photonics

Adhesives

Quantum dots

Indium arsenide

Integrated optics

Telecommunications

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