Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board

Sung Hwan Hwang; Woo-Jin Lee; Myoung Jin Kim; Eun Joo Jung; Gye Won Kim; Jong Bae An; Byung Sup Rho; Ki Young Jung; Kyung Soon Cha

doi:10.1117/1.OE.51.7.075402

25 July 2012 Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board

Sung Hwan Hwang, Woo-Jin Lee, Myoung Jin Kim, Eun Joo Jung, Gye Won Kim, Jong Bae An, Byung Sup Rho, Ki Young Jung, Kyung Soon Cha

Author Affiliations +

Optical Engineering, Vol. 51, Issue 7, 075402 (July 2012). https://doi.org/10.1117/1.OE.51.7.075402

Abstract

We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70×8×0.25 mm. The completed active module has features of thinness (0.5 mm), small size (7×5 mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).

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Sung Hwan Hwang, Woo-Jin Lee, Myoung Jin Kim, Eun Joo Jung, Gye Won Kim, Jong Bae An, Byung Sup Rho, Ki Young Jung, and Kyung Soon Cha "Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board," Optical Engineering 51(7), 075402 (25 July 2012). https://doi.org/10.1117/1.OE.51.7.075402

Published: 25 July 2012

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