Dr. Ahmed Gharbi Profile

Dr. Ahmed Gharbi

at CEA-LETI

SPIE Involvement:

Author

Publications (32)

Proceedings Article | 13 March 2024 Presentation

Presentation

Silicon nitride photonics: large scale integration and applications

Quentin Wilmart, Sylvain Guerber, Jonathan Faugier-Tovar, Eleonora Garoni , Laura Sauze, Lavinia Nistor, Ahmed Gharbi, Vincent Mathieu, Tristan Dewolf, Rémi Coquand, Christophe Lecouvey, Guillaume Rodriguez, Linda Gianini, Baptiste Routier, Leopold Virot

Proceedings Volume PC12889, PC128890C (2024) https://doi.org/10.1117/12.3001555

KEYWORDS: Silicon nitride, Quantum photonics, Thermography, Waveguides, Quantum sensing, Quantum computing, Physical vapor deposition, Photonic quantum computing, Optical sensing, Microwave radiation

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Proceedings Article | 13 October 2020 Presentation + Paper

Presentation + Paper

Hybrid E-beam lithography and process improvement for nanodevice fabrication

I. Servin, F. Laulagnet, M. Cannac, Ahmed Gharbi, J-A. Dallery

Proceedings Volume 11518, 115180U (2020) https://doi.org/10.1117/12.2572868

KEYWORDS: Electron beam lithography, Lithography, Deep ultraviolet, Optical alignment, 193nm lithography, Electron beam direct write lithography, Semiconducting wafers, Nanostructures, Nanolithography, Electron beams

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Proceedings Article | 3 April 2020 Paper

Paper

Establishing a sidewall image transfer chemo-epitaxial DSA process using 193 nm immersion lithography

G. Rademaker, A. Le Pennec, T. Giammaria, K. Benotmane, H. Pham, C. Bouet, M. G. Gusmao Cacho, M. Argoud, M.-L. Pourteau, A. Paquet, A. Gharbi, C. Navarro, C. Nicolet, X. Chevalier, K. Sakavuyi, P. Nealey, R. Tiron

Proceedings Volume 11326, 113260Z (2020) https://doi.org/10.1117/12.2552003

KEYWORDS: Lithography, Metrology, Directed self assembly, Immersion lithography, Photomasks, Optical lithography, Etching, Critical dimension metrology, Semiconducting wafers

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Proceedings Article | 26 March 2019 Paper

Paper

Spacer patterning lithography as a new process to induce block copolymer alignment by chemo-epitaxy

A. Paquet, A. Le Pennec, A. Gharbi, T. Giammaria, G. Rademaker, M.-L. Pourteau, D. Mariolle, C. Navarro, C. Nicolet, X. Chevalier, K. Sakavuyi, L. Pain, P. Nealey, R. Tiron

Proceedings Volume 10958, 109580M (2019) https://doi.org/10.1117/12.2514960

KEYWORDS: Etching, Lithography, Optical lithography, Wet etching, HF etching, Critical dimension metrology, Silicon, System on a chip, Tin

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Proceedings Article | 19 March 2018 Presentation

Presentation

DSA process characterization using BSE metrology (Conference Presentation)

Remi Le Tiec, Shimon Levi, Ahmed Gharbi, Maxime Argoud, Raluca Tiron, Gaelle Chamiot Maitral, Stephane Rey

Proceedings Volume 10586, 1058610 (2018) https://doi.org/10.1117/12.2299634

KEYWORDS: Directed self assembly, Metrology, Optical lithography, Etching, Manufacturing, 3D metrology, Materials processing, Polymers, Image processing, Scanning electron microscopy

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Proceedings Article | 19 March 2018 Presentation

Presentation

Inorganic guiding template implementation for DSA contact hole shrink process (Conference Presentation)

Ahmed Gharbi, Florian DELACHAT, Patricia Pimenta-Barros, Gaëlle Chamiot-Maitral, Maxime Argoud, Celine Lapeyre, Laurent Pain, Christophe Navarro, Célia Nicolet, Ian Cayrefourcq, Raluca Tiron

Proceedings Volume 10584, 105840D (2018) https://doi.org/10.1117/12.2297422

KEYWORDS: Directed self assembly, Optical lithography, Critical dimension metrology, Silicon, Oxides, Semiconducting wafers, Semiconductors, Materials processing, Photomasks, Photoresist processing

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Proceedings Article | 19 March 2018 Presentation

Presentation

Characterizing the internal structure of BCP filled contact holes with critical dimension small angle x-ray scattering (Conference Presentation)

Daniel Sunday, Florian Delachat, Ahmed Gharbi, Guillaume Freychet, Raluca Tiron, R. Joseph Kline

Proceedings Volume 10586, 105860X (2018) https://doi.org/10.1117/12.2297480

KEYWORDS: Scattering, X-rays, Directed self assembly, Integrated circuits, Optical lithography, Etching, 3D acquisition, 3D modeling

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Proceedings Article | 19 March 2018 Presentation + Paper

Presentation + Paper

Pillars fabrication by DSA lithography: material and process options

A. Gharbi, P. Pimenta-Barros, O. Saouaf, G. Reynaud, L. Pain, R. Tiron, C. Navarro, C. Nicolet, I. Cayrefourcq, M. Perego, F. Pérez-Murano, E. Amat, M. Fernández-Regúlez

Proceedings Volume 10586, 105860Q (2018) https://doi.org/10.1117/12.2297414

KEYWORDS: Polymethylmethacrylate, Picosecond phenomena, Directed self assembly, Annealing, Etching, Scanning electron microscopy, Dry etching, Silicon, Lithography, Plasma etching

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Proceedings Article | 10 April 2017 Presentation + Paper

Presentation + Paper

Nanoimprint, DSA, and multi-beam lithography: patterning technologies with new integration challenges

S. Landis, H. Teyssedre, G. Claveau, I. Servin, F. Delachat, M. L. Pourteau, A. Gharbi, P. Pimenta Barros, R. Tiron, L. Nouri, N. Possemé, M. May, P. Brianceau, S. Barnola, Y. Blancquaert, J. Pradelles, P. Essomba, A. Bernadac, B. Dal'zotto, S. Bos, M. Argoud, G. Chamiot-Maitral, A. Sarrazin, C. Tallaron, C. Lapeyre, L. Pain

Proceedings Volume 10149, 101490K (2017) https://doi.org/10.1117/12.2259966

KEYWORDS: Directed self assembly, Lithography, Line width roughness, Nanoimprint lithography, Semiconducting wafers, Etching, Electron beam lithography, System on a chip, Critical dimension metrology, Photoresist processing

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Proceedings Article | 27 March 2017 Presentation + Paper

Presentation + Paper

A high chi track-compatible DSA for sub-10nm L/S patterning

Douglas Guerrero, Kaumba Sakavuyi, Kui Xu, Ahmed Gharbi, Raluca Tiron, Isabelle Servin, Laurent Pain, Guillaume Claveau, Harold Stokes, Masahiko Harumoto, Célia Nicolet, Xavier Chevalier

Proceedings Volume 10146, 101460W (2017) https://doi.org/10.1117/12.2261094

KEYWORDS: Directed self assembly, Annealing, Optical lithography, Polymers, Scanning electron microscopy, Semiconducting wafers, Silicon, Line width roughness, Glasses, Ultraviolet radiation

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Proceedings Article | 21 March 2017 Paper

Paper

Advanced surface affinity control for DSA contact hole shrink applications

Florian Delachat, Ahmed Gharbi, Patricia Pimenta Barros, Maxime Argoud, Céline Lapeyre, Sandra Bos, Jérôme Hazart, Laurent Pain, Cédric Monget, Xavier Chevalier, Célia Nicolet, Christophe Navarro, Ian Cayrefourcq, Raluca Tiron

Proceedings Volume 10144, 101440O (2017) https://doi.org/10.1117/12.2258043

KEYWORDS: Directed self assembly, Lithography, Immersion lithography, Polymers, Semiconducting wafers, Polymethylmethacrylate, Scanning electron microscopy, Inspection, Image processing, Picosecond phenomena

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SPIE Journal Paper | 18 October 2016

Process highlights to enhance directed self-assembly contact patterning performances

Ahmed Gharbi, Raluca Tiron, Maxime Argoud, Gaëlle Chamiot-Maitral, Antoine Fouquet, Céline Lapeyre, Patricia Pimenta-Barros, Florian Delachat, Sandra Bos, Shayma Bouanani, Xavier Chevalier, Célia Nicolet, Christophe Navarro, Ian Cayrefourcq, Laurent Pain

JM3, Vol. 15, Issue 04, 043503, (October 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.4.043503

KEYWORDS: Directed self assembly, Optical lithography, Annealing, Picosecond phenomena, Critical dimension metrology, Scanning electron microscopy, Materials processing, Semiconducting wafers, Lithography, Molecular self-assembly

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SPIE Journal Paper | 27 April 2016

Placement error in directed self-assembly of block copolymers for contact hole application

Shayma Bouanani, Raluca Tiron, Sandra Bos, Ahmed Gharbi, Patricia Pimenta-Barros, Jérôme Hazart, Frédéric Robert, Céline Lapeyre, Alain Ostrovsky, Cédric Monget

JM3, Vol. 15, Issue 02, 021407, (April 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.2.021407

KEYWORDS: Directed self assembly, Critical dimension metrology, Polymethylmethacrylate, Smoothing, Image processing, Materials processing, Edge detection, Polymers, Error analysis, Metrology

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Proceedings Article | 1 April 2016 Paper

Paper

Investigation of coat-develop track system for placement error of contact hole shrink process

Masahiko Harumoto, Harold Stokes, Yuji Tanaka, Koji Kaneyama, Charles Pieczulewski, Masaya Asai, Isabelle Servin, Maxime Argoud, Ahmed Gharbi, Celine Lapeyre, Raluca Tiron, Cedric Monget

Proceedings Volume 9777, 97770O (2016) https://doi.org/10.1117/12.2219925

KEYWORDS: Lithography, Semiconducting wafers, Directed self assembly, Image processing, Scanning electron microscopy, Etching, Immersion lithography, Optical lithography, Annealing, Distance measurement

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Proceedings Article | 25 March 2016 Paper

Paper

Design of new block copolymer systems to achieve thick films with defect-free structures for applications of DSA into lithographic large nodes

X. Chevalier, P. Coupillaud, G. Lombard, C. Nicolet, J. Beausoleil, G. Fleury, M. Zelsmann, P. Bezard, G. Cunge, J. Berron, K. Sakavuyi, A. Gharbi, R. Tiron, G. Hadziioannou, C. Navarro, I. Cayrefourcq

Proceedings Volume 9779, 977913 (2016) https://doi.org/10.1117/12.2219214

KEYWORDS: Lithography, Optical lithography, Molecular self-assembly, Microelectronics, Directed self assembly, Semiconducting wafers, Fourier transforms, Polymer thin films, Polymers, Photomasks, Scanning electron microscopy, Etching, Plasma, Crystals, Chemistry

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Proceedings Article | 23 March 2016 Paper

Paper

PMMA removal selectivity to PS using dry etch approach: sub-10nm patterning application

A. Sarrazin, N. Posseme, P. Pimenta Barros, S. Barnola, G. Claveau, A. Gharbi, M. Argoud, G. Chamiot-Maitral, R. Tiron, C. Nicolet, C. Navarro, C. Cardinaud

Proceedings Volume 9782, 97820G (2016) https://doi.org/10.1117/12.2220586

KEYWORDS: Directed self assembly, Polymethylmethacrylate, Chemistry, Picosecond phenomena, Etching, Xenon, Plasma, Carbon monoxide, Plasma etching, Semiconducting wafers

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Proceedings Article | 22 March 2016 Paper

Paper

Process highlights to enhance DSA contact patterning performances

A. Gharbi, R. Tiron, M. Argoud, G. Chamiot-Maitral, A. Fouquet, C. Lapeyre, P. Pimenta Barros, A. Sarrazin, I. Servin, F. Delachat, S. Bos, S. Bérard-Bergery, J. Hazart, X. Chevalier, C. Nicolet, C. Navarro, I. Cayrefourcq, S. Bouanani, C. Monget

Proceedings Volume 9777, 97770T (2016) https://doi.org/10.1117/12.2219210

KEYWORDS: Directed self assembly, Optical lithography, Inspection, Lithography, Etching, Semiconducting wafers, Scanning electron microscopy, Defect detection, Critical dimension metrology, Materials processing, Photomasks, Picosecond phenomena, Annealing, Molecular self-assembly, Image processing

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SPIE Journal Paper | 18 June 2015

Contact holes patterning by directed self-assembly of block copolymers: process window study

Ahmed Gharbi, Raluca Tiron, Maxime Argoud, Xavier Chevalier, Patricia Pimenta-Barros, Célia Nicolet, Christophe Navarro

JM3, Vol. 14, Issue 02, 023508, (June 2015) https://doi.org/10.1117/12.10.1117/1.JMM.14.2.023508

KEYWORDS: Critical dimension metrology, Optical lithography, Semiconducting wafers, Annealing, Coating, Scanning electron microscopy, Lithography, Tolerancing, Inspection, Directed self assembly

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Proceedings Article | 27 March 2015 Paper

Paper

193i lithography for contact doubling with grapho-epitaxy DSA: a simulation study

A. Fouquet, L. Perraud, S. Bérard-Bergery, A. Gharbi, P. Pimenta-Barros, R. Tiron, J. Hazart, V. Farys

Proceedings Volume 9423, 942324 (2015) https://doi.org/10.1117/12.2085822

KEYWORDS: Lithography, Optical proximity correction, Optical lithography, 3D modeling, Scanners, Photomasks, Ions, Neck, Neodymium, Directed self assembly

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Proceedings Article | 20 March 2015 Paper

Paper

Blending approaches to enhance structural order in block-copolymer's self-assemblies

X. Chevalier, C. Nicolet, A. Gharbi, P. Pimenta-Barros, R. Tiron, G. Fleury, G. Hadziioannou, I. Iliopoulos, C. Navarro

Proceedings Volume 9425, 94251N (2015) https://doi.org/10.1117/12.2085821

KEYWORDS: Microelectronics, Lithography, Neodymium, Scanning electron microscopy, Critical dimension metrology, Polymethylmethacrylate, Oxygen, Ions, Thermodynamics, Directed self assembly

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Proceedings Article | 19 March 2015 Paper

Paper

Template affinity role in CH shrink by DSA planarization

R. Tiron, A. Gharbi, P. Pimenta Barros, S. Bouanani, C. Lapeyre, S. Bos, A. Fouquet, J. Hazart, X. Chevalier, M. Argoud, G. Chamiot-Maitral, S. Barnola, C. Monget, V. Farys, S. Berard-Bergery, L. Perraud, C. Navarro, C. Nicolet, G. Hadziioannou, G. Fleury

Proceedings Volume 9423, 942317 (2015) https://doi.org/10.1117/12.2085819

KEYWORDS: Polymethylmethacrylate, Lithography, Semiconducting wafers, Picosecond phenomena, Etching, Error analysis, Optical lithography, Line edge roughness, Image processing, Directed self assembly

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Density multiplication and contact shrinkage of patterned templates by directed self-assembly (DSA) of block copolymers (BCP) stands out as a promising alternative to overcome the limitations of conventional lithography. The main goal of this paper is to investigate the potential of DSA to address contact and via levels patterning with high resolution by performing either CD shrink or contact multiplication. Different DSA processes are benchmarked based on several success criteria such as: CD control, defectivity (missing holes) as well as placement control. More specifically, the methodology employed to measure DSA contact overlay and the impact of process parameters on placement error control is detailed. Using the 300mm pilot line available in LETI and Arkema’s materials, our approach is based on the graphoepitaxy of PS-b-PMMA block copolymers. Our integration scheme, depicted in figure 1, is based on BCP self-assembly inside organic hard mask guiding patterns obtained using 193i nm lithography. The process is monitored at different steps: the generation of guiding patterns, the directed self-assembly of block copolymers and PMMA removal, and finally the transfer of PS patterns into the metallic under layer by plasma etching. Furthermore, several process flows are investigated, either by tuning different material related parameters such as the block copolymer intrinsic period or the interaction with the guiding pattern surface (sidewall and bottom-side affinity). The final lithographic performances are finely optimized as a function of the self-assembly process parameters such as the film thickness and bake (temperature and time). Finally, DSA performances as a function of guiding patterns density are investigated. Thus, for the best integration approach, defect-free isolated and dense patterns for both contact shrink and multiplication (doubling and more) have been achieved on the same processed wafer. These results show that contact hole shrink and multiplication approach using DSA is well compatible with the conventional integration used for CMOS technology.

Proceedings Article | 17 March 2015 Paper

Paper

DSA planarization approach to solve pattern density issue

P. Pimenta Barros, A. Gharbi, Aurélien Sarrazin, R. Tiron, N. Posseme, S. Barnola, S. Bos, C. Tallaron, G. Claveau, X. Chevalier, M. Argoud, Isabelle Servin, C. Navarro, Célia Nicolet, C. Lapeyre, C. Monget

Proceedings Volume 9428, 94280D (2015) https://doi.org/10.1117/12.2086810

KEYWORDS: Polymethylmethacrylate, Etching, Critical dimension metrology, Picosecond phenomena, Semiconducting wafers, Chemistry, Scanning electron microscopy, Carbon monoxide, Dry etching, Directed self assembly

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Proceedings Article | 17 October 2014 Paper

Paper

Compact model experimental validation for grapho-epitaxy hole processes and its impact in mask making tolerances

Germain Fenger, J. Andres Torres, Yuansheng Ma, Yuri Granik, Polina Krasnova, Antoine Fouquet, Jérôme Belledent, Ahmed Gharbi, Raluca Tiron

Proceedings Volume 9231, 92310Q (2014) https://doi.org/10.1117/12.2065840

KEYWORDS: Data modeling, Scanning electron microscopy, Photomasks, Optical proximity correction, Semiconducting wafers, Calibration, Neodymium, Mask making, Tolerancing, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Paper

Etch challenges for DSA implementation in CMOS via patterning

P. Pimenta Barros, S. Barnola, A. Gharbi, M. Argoud, I. Servin, R. Tiron, X. Chevalier, C. Navarro, C. Nicolet, C. Lapeyre, C. Monget, E. Martinez

Proceedings Volume 9054, 90540G (2014) https://doi.org/10.1117/12.2046267

KEYWORDS: Etching, Polymethylmethacrylate, Picosecond phenomena, Plasma, Chemistry, Optical lithography, Argon, Dry etching, Dielectrics, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Paper

Plasma etching and integration challenges using alternative patterning techniques for 11nm node and beyond

S. Barnola, P. Pimenta Barros, C. Arvet, C. Vizioz, N. Posseme, A. Gharbi, M. Argoud, R. Tiron, J. Pradelles, L. Desvoivres, S. Barraud

Proceedings Volume 9054, 90540E (2014) https://doi.org/10.1117/12.2046251

KEYWORDS: Etching, Electron beam lithography, Polymethylmethacrylate, Silicon, Picosecond phenomena, Photomasks, Chemistry, Lithography, System on a chip, Metals

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Proceedings Article | 28 March 2014 Paper

Paper

Self-assembly of high-resolutions PS-b-PMMA block-copolymers: processes capabilities and integration on 300mm track

X. Chevalier, C. Nicolet, R. Tiron, A. Gharbi, G. Chamiot-Maitral, K. Jullian, P. Pimenta-Barros, M. Argoud, J.-L. Peyre, R. Van Spaandonk, G. Fleury, G. Hadziioannou, C. Navarro

Proceedings Volume 9049, 90490Y (2014) https://doi.org/10.1117/12.2046313

KEYWORDS: Polymers, Lithography, Semiconducting wafers, Molecular self-assembly, Polymerization, Picosecond phenomena, Etching, Thin films, Polymethylmethacrylate, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Paper

300mm pilot line DSA contact hole process stability

M. Argoud, I. Servin, A. Gharbi, P. Pimenta Barros, K. Jullian, M. Sanche, G. Chamiot-Maitral, S. Barnola, R. Tiron, C. Navarro, X. Chevalier, C. Nicolet, G. Fleury, G. Hadziioannou, M. Asai, C. Pieczulewski

Proceedings Volume 9049, 904929 (2014) https://doi.org/10.1117/12.2046315

KEYWORDS: Polymethylmethacrylate, Etching, Lithography, Critical dimension metrology, Semiconductors, Electron beam lithography, Semiconducting wafers, Silicon, High volume manufacturing, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Paper

Improvements of self-assembly properties via homopolymer addition or block-copolymer blends

X. Chevalier, C. Nicolet, R. Tiron, Ahmed Gharbi, M. Argoud, C. Couderc, Guillaume Fleury, G. Hadziioannou, I. Iliopoulos, C. Navarro

Proceedings Volume 9049, 90490T (2014) https://doi.org/10.1117/12.2046329

KEYWORDS: Lithography, Molecular self-assembly, Picosecond phenomena, Statistical analysis, Polymers, Thin films, Binary data, Microelectronics, Polymethylmethacrylate, Scanning electron microscopy

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Proceedings Article | 28 March 2014 Paper

Paper

Contact holes patterning by directed self-assembly of block copolymers: What would be the Bossung plot?

A. Gharbi, R. Tiron, M. Argoud, X. Chevalier, J. Belledent, J. Pradelles, P. Pimenta Barros, C. Navarro, C. Nicolet, G. Hadziioannou, G. Fleury, S. Barnola

Proceedings Volume 9049, 90491N (2014) https://doi.org/10.1117/12.2046342

KEYWORDS: Critical dimension metrology, Optical lithography, Semiconducting wafers, Annealing, Scanning electron microscopy, Coating, Tolerancing, Lithography, Inspection, Directed self assembly

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SPIE Journal Paper | 1 July 2013

Scaling-down lithographic dimensions with block-copolymer materials: 10-nm-sized features with poly(styrene)-block-poly(methylmethacrylate)

Xavier Chevalier, Célia Nicolet, Raluca Tiron, Ahmed Gharbi, Maxime Argoud, Jonathan Pradelles, Michael Delalande, Gilles Cunge, Guillaume Fleury, Georges Hadziioannou, Christophe Navarro

JM3, Vol. 12, Issue 03, 031102, (July 2013) https://doi.org/10.1117/12.10.1117/1.JMM.12.3.031102

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Proceedings Article | 26 March 2013 Paper

Paper

Scaling-down lithographic dimensions with block-copolymer materials: 10nm-sized features with PS-b-PMMA

X. Chevalier, C. Nicolet, R. Tiron, A. Gharbi, M. Argoud, J. Pradelles, M. Delalande, G. Cunge, G. Fleury, G. Hadziioannou, C. Navarro

Proceedings Volume 8680, 868006 (2013) https://doi.org/10.1117/12.2011405

KEYWORDS: Polymers, Lithography, Molecular self-assembly, Picosecond phenomena, Polymethylmethacrylate, Scanning electron microscopy, Silica, Silicon, Thin films, Electron beam lithography

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Proceedings Article | 26 March 2013 Paper

Paper

The potential of block copolymer’s directed self-assembly for contact hole shrink and contact multiplication

R. Tiron, A. Gharbi, M. Argoud, X. Chevalier, J. Belledent, P. Pimmenta Barros, I. Servin, C. Navarro, G. Cunge, S. Barnola, L. Pain, M. Asai, C. Pieczulewski

Proceedings Volume 8680, 868012 (2013) https://doi.org/10.1117/12.2011477

KEYWORDS: Etching, Polymethylmethacrylate, Picosecond phenomena, Lithography, Polymers, 193nm lithography, Critical dimension metrology, Oxygen, Neodymium, Directed self assembly

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Showing 5 of 32 publications

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