Mr. Chain-Ting Huang Profile

Chain-Ting Huang

at United Microelectronics Corp

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Author

Publications (6)

Proceedings Article | 26 September 2019 Paper

Practical lithography hotspot identification using mask process model

Pai Chi Chen, Chain Ting Huang, Shang Feng Weng, Yung Feng Cheng, Young Ham, Colbert Lu, Michael Green, Mohamed Ramadan, Hong Jen Lee, Chris Progler

Proceedings Volume 11148, 111481H (2019) https://doi.org/10.1117/12.2537935

KEYWORDS: Lithography, Photomasks, Process modeling, Optical proximity correction, Semiconducting wafers, Machine learning, Resolution enhancement technologies, Source mask optimization, Critical dimension metrology, Computer simulations

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Proceedings Article | 27 June 2019 Paper

Mask process correction for optical weak pattern improvement

Pai Chi Chen, Chain Ting Huang, Shang Feng Weng, Yung Feng Cheng, Kazunori Nagai, Kenji Kono

Proceedings Volume 11178, 111780Q (2019) https://doi.org/10.1117/12.2535770

KEYWORDS: Photomasks, Optical proximity correction, Scanning electron microscopy, Optical calibration, Critical dimension metrology, Optical simulations, Bridges, Etching, Calibration, Wafer-level optics

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Proceedings Article | 23 October 2015 Paper

In die mask overlay control for 14nm double-patterning lithography

William Chou, James Cheng, Alex Tseng, J. Wu, Chin Kuei Chang, Jeffrey Cheng, Adder Lee, Chain Ting Huang, N. Peng, Simon C. Hsu, Chun Chi Yu, Colbert Lu, Julia Yu, Peter Craig, Chuck Pollock, Young Ham, Jeff McMurran

Proceedings Volume 9635, 96351R (2015) https://doi.org/10.1117/12.2196794

KEYWORDS: Photomasks, Semiconducting wafers, Overlay metrology, Image registration, Double patterning technology, Lithography, Source mask optimization, Reticles, Pellicles, 193nm lithography

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Proceedings Article | 31 March 2014 Paper

Pattern environment impact on wafer of metal layers with high-NA process on advanced node

Chain Ting Huang, Yung Feng Cheng, Ming Jui Chen

Proceedings Volume 9052, 90522A (2014) https://doi.org/10.1117/12.2046195

KEYWORDS: Photomasks, Semiconducting wafers, Bridges, Optical proximity correction, Metals, Printing, Scattering, Error analysis, Double patterning technology, Photoresist materials

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Proceedings Article | 30 June 2012 Paper

EUV and 193 mask line width roughness (LWR) impact on wafer CD LWR

Chain Ting Huang, Cloud Cheng, Ming Jui Chen

Proceedings Volume 8441, 84410V (2012) https://doi.org/10.1117/12.964397

KEYWORDS: Line width roughness, Photomasks, Semiconducting wafers, Extreme ultraviolet, Printing, 3D modeling, Wafer-level optics, Line edge roughness, Scanning electron microscopy, Critical dimension metrology

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Proceedings Article | 19 May 2008 Paper

Inspectability of PSM masks for the 32nm node using STARlight2+

Chain-Ting Huang, Yung-Feng Cheng, Shih-Ming Kuo, Chun-Hsien Huang, Swapnajit Chakravarty, Joe Huang, Jeff Lin, Den Wang

Proceedings Volume 7028, 70282P (2008) https://doi.org/10.1117/12.793095

KEYWORDS: Inspection, Reticles, Photomasks, Calibration, Reflectivity, Image processing, Contamination, Semiconducting wafers, Lithography, Manufacturing

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Showing 5 of 6 publications

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