The authors review the technological trends for the future AMOLED, especially for unique applications to small- and
medium-sized displays as well as large-sized AMOLED TV. The unique characteristics of AMOLED enable paper-thin,
foldable, bendable and transparent displays which the other display technology can't easily realize. For large-sized
AMOLED TV, TFT backplane, color patterning and encapsulation are the key technological issues and the new
technologies should be developed for the mass production of AMOLED TV. The issues and some candidate technologies
which can pave the way for mass production of AMOLED TV are also briefly reviewed.
The mask error enhancement factor (MEEF) minimization is much emphasized due to the reduction of the device technology node. The MEEF is defined as how mask critical dimension (CD) errors are translated into wafer CD errors. We found that the pattern density had influenced the MEEF and the MEEF changed with the pattern density variation. We also tried to obtain the 90 nm CD value with optimized diffusion length of the chemically amplified resist. It turned out that a very small diffusion length should be used to get the desired 90 nm line width with 193 nm. We used line and space (L/S) dense bars, 3 L/S bars only and isolated line pattern for the pattern density dependency and to obtain different MEEFs. In order to determine the MEEF by the various pattern densities, a commercial simulation tool, Solid-E, was used. We could obtain the minimum MEEF values for the different pattern densities by using this procedure.
MEEF (Mask Error Enhancement Factor) is the most representative index which CD (Critical Dimension) variation in wafer is amplified by real specific mask CD variation. Already, as it was announced through other papers, MEEF is increased by small k1 or pattern pitch. Illumination system, just like lens aberration or stage defocus affects directly MEEF value, but the leveling or species of substrate and the resist performance are also deeply related to MEEF value. Actually, when the engineers set up the photo process of shrink structure in current device makers, they established minimum shot uniformity target such as MEEF value within wafer uniformity and wafer to wafer uniformity, besides UDOF (Usable Depth of Focus) or EL (Exposure Latitude) margin.
We examined MEEF reduction by checking the difference in resist parameters and tried to correlate the results between experiment and simulation. Solid-C was used for simulation tool. The target node was dense L/S (Line/Space) of sub-80 nm and we fix the same illumination conditions. We calculated MEEF values by comparing to original mask uniformity through the optical parameters of each resist type. NILS (Normalized Image Log Slope) shows us some points of the saturation value with pupil mesh points and the aberration was not considered. We used four different type resists and changed resist optical properties (i.e. n, k refractive index; A, B, and C Dill exposure parameters). It was very difficult to measure the kinetic phenomenon, so we choose Fickian model in PEB (Post Exposure Bake) and Weiss model in development. In this paper, we tried to suggest another direction of photoresist improvement by comparing the resist parameters to MEEF value of different pitches.
MEEF (Mask Error Enhancement Factor) is the most representative index which CD (Critical Dimension) variation in wafer is amplified by real specific mask CD variation. Already, as it was announced through other papers, MEEF is increased by small k1 or pattern pitch. Illumination system, just like lens aberration or stage defocus affects directly MEEF value, but the leveling or species of substrate and the resist performance are also deeply related to MEEF value. Actually, when the engineers set up the photo process of shrink structure in current device makers, they established minimum shot uniformity target such as MEEF value within wafer uniformity and wafer to wafer uniformity, besides UDOF (Usable Depth of Focus) or EL (Exposure Latitude) margin. We examined MEEF reduction by checking the difference in resist parameters and tried to correlate the results between experiment and simulation. Solid-C was used for simulation tool. The target node was dense L/S (Line/Space) of sub-80 nm and we fix the same illumination conditions. We calculated MEEF values by comparing to original mask uniformity through the optical parameters of each resist type. NILS (Normalized Image Log Slope) shows us some points of the saturation value with pupil mesh points and the aberration was not considered. We used four different type resists and changed resist optical properties (i.e. n, k refractive index; A, B, and C Dill exposure parameters). It was very difficult to measure the kinetic phenomenon, so we choose Fickian model in PEB (Post Exposure Bake) and Weiss model in development. In this paper, we tried to suggest another direction of photoresist improvement by comparing the resist parameters to MEEF value of different pitches.
KEYWORDS: Diffusion, Photoresist materials, Line edge roughness, Polymers, Atomic force microscopy, Temperature metrology, Scanning electron microscopy, Photoresist developing, Lithography, Glasses
LER of an acetal-type photoresist (PR) and an annealing-type PR was measured by Atomic Force Microscopy, with which LER is more quantitatively measurable than using SEM. The annealing-type PR showed smaller LER than acetal-type did. Acid diffusion length measurement of these two types of KrF photoresists with a practical method that is a measurement of the thickness loss in a resist film after development which follows placement of exposed resist powder on the surface and applying PEB was also executed. The annealing-type PR has been found to show longer acid diffusion length than that of acetal-type PR. Considering deblocking temperature, acetal group is cleaved right upon exposure before PEB due to its relatively low activation energy. This means that there would be more hydroxystyrene units in acetal-type PR at the beginning of PEB than in annealing-type one. Tg of photoresist samples before and after deblocking reaction was also measured by DSC. After deblocking reaction, it was found that Tg of acetal-type PR is much higher than that of annealing-type PR. This relatively high Tg will make acetal-type PR to have shorter acid diffusion length in conjunction with relatively low PEB temperature comparing with annealing-type in general. The absolute Tg value and Tg change with deblocking reaction depending on types of PRs were correlated to explain the inherent difference in LER performance in different types of PRs.
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