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Christian Vieider
Managing Director at Ascatron AB
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Author
Publications (4)
Proceedings Article | 4 January 2008 Paper
MEMS-based uncooled infrared bolometer arrays: a review
Frank Niklaus, Christian Vieider, Henrik Jakobsen
Proceedings Volume 6836, 68360D (2008) https://doi.org/10.1117/12.755128
KEYWORDS: Bolometers, Infrared bolometers, Readout integrated circuits, Semiconducting wafers, Infrared radiation, Infrared imaging, Wafer bonding, Staring arrays, Resistance, Silicon
Proceedings Article | 14 May 2007 Paper
Low-cost far infrared bolometer camera for automotive use
Christian Vieider, Stanley Wissmar, Per Ericsson, Urban Halldin, Frank Niklaus, Göran Stemme, Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Henrik Jakobsen, Terje Kvisterøy, John Franks, Jan VanNylen, Hans Vercammen, Annick VanHulsel
Proceedings Volume 6542, 65421L (2007) https://doi.org/10.1117/12.721272
KEYWORDS: Semiconducting wafers, Bolometers, Sensors, Readout integrated circuits, Wafer bonding, Germanium, Cameras, Packaging, Quantum wells, Far infrared
Proceedings Article | 29 September 2006 Paper
High signal-to-noise ratio quantum well bolometer materials
Stanley Wissmar, Linda Höglund, Jan Andersson, Christian Vieider, Susan Savage, Per Ericsson
Proceedings Volume 6401, 64010N (2006) https://doi.org/10.1117/12.689874
KEYWORDS: Quantum wells, Doping, Bolometers, Aluminum, Germanium, Silicon, Resistance, Crystals, Signal to noise ratio, Amorphous silicon
Proceedings Article | 21 April 2006 Paper
Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet both performance and cost targets
Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Stéphane Junique, Susan Savage, Christian Vieider, Jan Andersson, John Franks, Jan Van Nylen, Hans Vercammen, Terje Kvisterøy, Frank Niklaus, Göran Stemme
Proceedings Volume 6198, 619809 (2006) https://doi.org/10.1117/12.663152
KEYWORDS: Long wavelength infrared, Sensors, Germanium, Semiconducting wafers, Bolometers, Wafer bonding, Manufacturing, Cameras, Readout integrated circuits, Packaging
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