Photonics packaging applications require significantly higher precision die bonding processes than traditional electronics and RF/microwave devices. Die placement accuracy of microns and better has been demonstrated. Key factors affecting the capability ofplacing die at accuracies of 5microns in photonics packaging are discussed. Factors that enable high accuracy die bonding range from machine platform design to a combination ofprocess parameters. Another key factor in die bonding placement accuracy is the quality of visual reference points or fiducials on the die, substrate, or surrounding package. Examples ofgood and poor visual references are shown and a discussion ofdie and package design is presented. A method ofplacement accuracy validation and a discussion ofhigh accuracy die bonding applications are presented.
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