Mr. Edward Yu Huan Liu Profile

Edward Yu Huan Liu

at United Microelectronics Corp

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 6 April 2012 Paper

Apply low-temperature plasma in the rework procedure of Al film structure to prevent pattern collapsed and CuAl[sub]2[/sub] precipitation

Jau Yu Tsai, Kung Hsun Tsao, Tsz Yuan Chen, Chih Chung Huang, Huan Hsin Yeh, Yu Huan Liu

Proceedings Volume 8324, 83243B (2012) https://doi.org/10.1117/12.917888

KEYWORDS: Plasma, Aluminum, Photoresist processing, Etching, Semiconducting wafers, Wet etching, Bridges, Metals, Copper, Lithography

Read Abstract +

Proceedings Article | 31 March 2010 Paper

Accelerating the dual damascene process time by new filling material

Kung-Hsun Tsao, Yu-Huan Liu, Tsz-Yuan Chen, Chih-Jung Chen, C. Huang, Yung-Cheng Chang, Go Noya, Nick Hsiao, Simon Chiu, Vencent Chang, Tomohide Katayama, Hisashi Motobayashi

Proceedings Volume 7639, 76392A (2010) https://doi.org/10.1117/12.855997

KEYWORDS: Etching, Coating, Lithography, Optical lithography, Yield improvement, Semiconducting wafers, Absorption, Chemistry, Reflectivity, Natural surfaces

Read Abstract +

Proceedings Article | 26 March 2008 Paper

Improvement of 90nm technology VIA photo alignment through TiN hard mask removing above previous photo alignment mark area

Wen-Shiang Liao, Hsin-Hung Lin, Yu-Huan Liu, Mao-Chyuan Tang, Sheng-Yi Huang, Cheng-Han Wu, Yue-Gie Liaw, Tung-Hung Chen, Tommy Shih, Kun-Ming Chen

Proceedings Volume 6923, 69233Y (2008) https://doi.org/10.1117/12.772286

KEYWORDS: Optical alignment, Tin, Photomasks, Copper, Semiconducting wafers, Signal detection, Scanners, Optical lithography, Metals, Logic

Read Abstract +

Proceedings Article | 5 April 2007 Paper

Study on micro-bubble defect induced by RRC coating

Yu-Huan Liu, Wen-Shiang Liao, Hsin-Hung Lin, Chin-Jung Chen, C. C. Huang

Proceedings Volume 6518, 65184L (2007) https://doi.org/10.1117/12.711933

KEYWORDS: Coating, Semiconducting wafers, Scanning electron microscopy, Inspection, Etching, Photomasks, Temperature metrology, Metrology, Process control, Optical lithography

Read Abstract +

Proceedings Article | 27 March 2007 Paper

A thin FinFET Si-fin body structure fabricated with 193-nm scanner photolithography and composite hard mask etching technique upon bulk-Si substrate

Wen-Shiang Liao, Yu-Huan Liu, Wen-Tung Chang, Tung-Hung Chen, Tommy Shih, Huan-Chiu Tsen, Lee Chung

Proceedings Volume 6520, 65204N (2007) https://doi.org/10.1117/12.714391

KEYWORDS: Photomasks, Composites, Etching, Plasma etching, Scanners, Silicon, Optical lithography, Plasma, 193nm lithography

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years