Mr. Kaidong D. Ye Profile

Kaidong D. Ye

Research Engineer at Data Storage Institute

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Author

Publications (11)

Proceedings Article | 1 March 2006 Paper

Laser treatment of micro-components’ surface for improved tribological applications

Kaidong Ye, Yeow-Whatt Goh, Cheow-Tong Cheng, Ching-Biing Yeo, Minghui Hong

Proceedings Volume 6106, 61060X (2006) https://doi.org/10.1117/12.645602

KEYWORDS: Laser therapeutics, Surface finishing, Surface roughness, Silicon, Semiconductor lasers, Laser scanners, Polishing, Laser processing, Profilometers, Annealing

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Proceedings Article | 8 October 2004 Paper

Low resistivity glass metallization by laser induced plasma-assisted ablation

Ming Hui Hong, Qiong Xie, B. Lim, Koji Sugioka, Katsumi Midorikawa, Kaidong Ye, Luping Shi, Tow Chong Chong

Proceedings Volume 5662, (2004) https://doi.org/10.1117/12.596543

KEYWORDS: Metals, Glasses, Resistance, Thin films, Laser ablation, Plasma, Laser scanners, Aluminum, Annealing, Excimer lasers

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Proceedings Article | 18 November 2003 Paper

Laser-induced diffusion for glass metallization

Dong Wu, Ming Hong, R. Ji, Kaidong Ye, Sumei Huang, Tow Chong, T. Ma, Koji Sugioka, Katsumi Midorikawa

Proceedings Volume 5063, (2003) https://doi.org/10.1117/12.540496

KEYWORDS: Glasses, Metals, Plasma, Laser ablation, Pulsed laser operation, Plasma generation, Laser energy, Diffusion, Thin films, Particles

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Proceedings Article | 18 November 2003 Paper

Laser microfabrication of glass substrates by pocket scanning

B. Lan, Ming Hui Hong, Kaidong Ye, Z. Wang, Tow Chong Chong

Proceedings Volume 5063, (2003) https://doi.org/10.1117/12.540725

KEYWORDS: Glasses, Laser ablation, Microfabrication, Nd:YAG lasers, Laser glasses, Pulsed laser operation, Laser scanners, Carbon dioxide lasers, Excimer lasers, Diffusion

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Proceedings Article | 19 February 2003 Paper

Laser ablation for MEMS microfabrication on Si and Kapton substrates

B. Lan, Ming Hui Hong, Kaidong Ye, Shi Xin Chen, Tow Chong Chong

Proceedings Volume 4830, (2003) https://doi.org/10.1117/12.486521

KEYWORDS: Laser drilling, Laser ablation, Microelectromechanical systems, Scanning electron microscopy, Microfabrication, Silicon, Fabrication, Pulsed laser operation, Laser applications, Diffraction

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Proceedings Article | 12 September 2002 Paper

Laser creating precise three-dimensional image of object inside glass

Chengwu An, Kaidong Ye, Ming Hui Hong

Proceedings Volume 4915, (2002) https://doi.org/10.1117/12.482896

KEYWORDS: Glasses, Refraction, Optical spheres, 3D image processing, Solids, Refractive index, Laser processing, 3D acquisition, Laser drilling, Interfaces

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Proceedings Article | 18 June 2002 Paper

Laser applications in integrated circuit packaging

Yongfeng Lu, Wen Song, ZhongMin Ren, Chengwu An, Kaidong Ye, DaMing Liu, Weijie Wang, Ming Hui Hong, Tow Chong Chong

Proceedings Volume 4637, (2002) https://doi.org/10.1117/12.470667

KEYWORDS: Laser applications, Laser welding, Laser marking, Silicon, Plasma, Laser processing, Laser development, Laser ablation, Packaging, Disk lasers

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Proceedings Article | 25 February 2002 Paper

Laser marking on IC package by micro-encapsulated tapes

Kaidong Ye, Chengwu An, Yuan Yuan, Yongfeng Lu

Proceedings Volume 4426, (2002) https://doi.org/10.1117/12.456892

KEYWORDS: Laser marking, Pulsed laser operation, Laser irradiation, Laser damage threshold, Coating, Laser ablation, Ultraviolet radiation, Nd:YAG lasers, Laser systems engineering, Laser energy

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Proceedings Article | 25 February 2002 Paper

Laser singulation of IC packages

Chengwu An, Kaidong Ye, Yuan Yuan, Minghui Hong, Yongfeng Lu

Proceedings Volume 4426, (2002) https://doi.org/10.1117/12.456850

KEYWORDS: Laser cutting, Copper, Laser processing, Nd:YAG lasers, Absorption, Manufacturing, Epoxies, Glasses, Polymers, Laser irradiation

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Proceedings Article | 28 September 2001 Paper

Wafer dicing by laser-induced thermal shock process

Kaidong Ye, Chengwu An, Ming Hui Hong, Yongfeng Lu

Proceedings Volume 4557, (2001) https://doi.org/10.1117/12.442940

KEYWORDS: Semiconducting wafers, Laser cutting, Silicon, Wafer dicing, Laser irradiation, Semiconductor lasers, Laser scanners, Pulsed laser operation, Laser processing, Mirrors

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Proceedings Article | 18 August 1997 Paper

Cleaning force in laser cleaning of silicon substrates

Wen Song, Yongfeng Lu, Kaidong Ye, C. Tee, Minghui Hong, Daming Liu, Tohsiew Low

Proceedings Volume 3184, (1997) https://doi.org/10.1117/12.280569

KEYWORDS: Pulsed laser operation, Silicon, Semiconductor lasers, Particles, Laser damage threshold, Solids, Quartz

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Showing 5 of 11 publications

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