CONFERENCE PROCEEDINGS
Advanced Search
Katsuo Taniguchi
at Merck Electronics Ltd
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 1 May 2023 Poster + Paper
Novel polymer design for ultra-low stress material for advanced packaging applications
F. Meyer, M. Koch, K. Nishikawa, G. Larbig, K. Taniguchi
Proceedings Volume 12498, 124981R (2023) https://doi.org/10.1117/12.2658391
KEYWORDS: Polymers, Polymer thin films, Dielectrics, Semiconducting wafers, Shrinkage, Ultraviolet radiation, Coating stress, Thermal stability
SIGN IN TO:
  • View contact details
UPDATE YOUR PROFILE
Is this your profile? Update it now.
Sign into your SPIE.org account
Don’t have a profile and want one?
Create an account on SPIE.org
Advertisement
Advertisement
Back to Top