Heterogeneous integration of new materials promises to significantly expand the range of capabilities accessible by silicon photonic integrated circuits (PICs). However, the classical integration protocols, which involves etching trenches through the backend-of-the-line (BEOL) layers to access the PIC for subsequent material bonding or deposition, face severe limitations in integration capacity, packaging density, and process complexity. Moreover, the inability to utilize the BEOL layers is a major missed opportunity for innovative 2.5-D photonic device designs. In this talk, we will unveil a new, universal heterogeneous integration platform: Substrate-inverted Multi-Material Integration Technology (SuMMIT). The SuMMIT integration scheme leverages advanced wafer-scale 3-D packaging technologies such as through-Si vias and direct bond interconnects to enable seamless integration of non-CMOS materials.
Laser-based 3-D nanoprinting exemplified by two photon polymerization (TPP) has emerged as a practical route for additive manufacturing of sub-wavelength scale structures with broad applications in photonic packaging, nanofluidics, nanoelectromechanical systems, drug delivery, tissue engineering, and beyond. Conventional TPP relies on compound refractive lenses for light focusing. Here we present a novel alternative approach leveraging optical metalenses as the light manipulation element for versatile TPP fabrication. Using an inverse design algorithm, we show that the point spread function (PSF) of the metalens can be custom tailored to realize a variety of TPP writing modes, enabling fabrication of unconventional geometries difficult to process with traditional TPP. We demonstrated integration of metalenses with both commercial and home-built TPP systems, and experimentally implemented TPP to writing of 3-D polymer microstructures.
MassTech Collaborative has helped to make the Commonwealth of Massachusetts a beacon for advanced manufacturing. In partnership with the AIM Photonics manufacturing institute, MassTech has launched five Laboratories for Education and Application Prototypes (LEAPs) within academic institutions and/or companies spread across Massachusetts, to develop a skilled workforce in integrated photonics. Hands-on and in-person workshops, bootcamps and laboratory courses are offered at these LEAPs to learners from academia, industry, and the government. The MA LEAP network stands as an excellent self-sustaining model for hands-on STEM education and workforce training for the rest of the country.
Optical coupling between fibers and on-chip waveguides is a critical step in photonic testing and packaging. We demonstrated broadband surface-normal fiber-to-chip optical coupling based on free-form micro-optical reflector arrays integrated with foundry-processed SiN photonics. The couplers yield a low fiber-to-waveguide coupling loss of 0.5 dB at 1550 nm wavelength, and an exceptionally broad 1-dB bandwidth encompassing O to L bands (1260 nm to 1640 nm), only limited by the wavelength range of our testing setup. In-plane 1-dB alignment tolerances up to ± 2.4 µm and an out-of-plane 1-dB alignment tolerance up to 20 µm were obtained at 1550 nm. We further show that the Optical Free-Form Couplers for High-density Integrated Photonics (OFFCHIP) platform is universally applicable for chip-to-chip, waveguide to free space, and waveguide to surface-normal device coupling, qualifying it as a universal high-performance optical coupling interface for diverse use scenarios.
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