We present inter-chip optical link based on direct optical wire (DOW) bonding technology fabricated by meniscus-guided polymerization in open-air. The arch shape DOW structure is formed in a single procedure for directly linking silicon photonic chips, where grating couplers are integrated to out-couple guided optical modes. Although a typical grating coupler is employed, the inter-chip DOW link supports a low insertion loss of 6 dB in total with a wavelength-insensitive operation in the measured wavelength range of 1520 nm to 1590 nm. The half-arch shape DOW for linking chip-to-fiber is also shown to verify the feasibility of hybrid integration with edge coupling devices. DOW bonding technology can provide a convenient route to enable direct optical link capable of agile and high-throughput manufacturing for inter-chip optical interconnection.
The direct optical wiring (DOW) technology which is based on the 3D writing of optically transparent polymer wires using a meniscus-guided method is employed to develop multi-mode optical interconnects for VCSEL-MMF applications. This DOW method, similar in concept to conventional electrical wire bonding, does not require any chemical reactions. DOW bonding is used to optically connect high-speed VCSELs and standard OM3 multi-mode fibers (MMFs). The resulting simplified lens-free transmitter modules show a high coupling efficiency (65%) and 12 Gbit/sec error-free transmission per-channel, which is satisfactory for optical HDMI 2.1 applications. In the presentation, the 4K-60Hz performance transmitted through the HDMI2.1 will be demonstrated and extended single-mode results introduced. We believe that DOW bonding can be a powerful platform technology for optical interconnect and photonic integration for innovative industrial and academic photonic applications.
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