Mr. Paul B. Jaynes Profile

Paul B. Jaynes

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Proceedings Article | 18 May 2006 Paper

Integrated microsystems packaging approach with LCP

Paul Jaynes, Lawrence Shacklette

Proceedings Volume 6232, 62320M (2006) https://doi.org/10.1117/12.665505

KEYWORDS: Polymers, Sensors, Packaging, Liquid crystals, Dielectrics, Acoustics, Microsystems, Polymer thick film flex circuits, Copper, Telecommunications

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Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

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