Mr. Tae Hyun Kim Profile

Tae Hyun Kim

at National Nanofab Ctr

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 19 June 2013 Paper

Wafer-level reliability characterization for wafer-level packaged microbolometer with ultra-small array size

Hee Yeoun Kim, Chungmo Yang, Jae Hong Park, Ho Jung, Taehyun Kim, Kyung Tae Kim, Sung Kyu Lim, Sang Woo Lee, Jay Mitchell, Wook Joong Hwang, Kwyro Lee

Proceedings Volume 8704, 87043E (2013) https://doi.org/10.1117/12.2015738

KEYWORDS: Semiconducting wafers, Microbolometers, Sensors, Resistance, Packaging, Reliability, Wafer bonding, Wafer testing, Wafer-level optics, Amorphous silicon

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Proceedings Article | 15 October 2012 Paper

Studies on transmittance of silicon with AR coating films for IR transparent window

Myeongho Song, Eunmi Park, Moon Hyun, Tae Kim, Hee Kim, Gawon Lee

Proceedings Volume 8512, 85120P (2012) https://doi.org/10.1117/12.928346

KEYWORDS: Silicon, Transmittance, Silicon films, Infrared sensors, Antireflective coatings, Zinc, Germanium, Semiconducting wafers, Sensors, Autoregressive models

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Proceedings Article | 31 May 2012 Paper

Study on optimizing the thickness of silicon window of WLP for IR sensor

Myeongho Song, Tae Hyun Kim, Moon Seop Hyun, Jae Hong Park, Hee Yeoun Kim, Gawon Lee

Proceedings Volume 8353, 83532B (2012) https://doi.org/10.1117/12.918982

KEYWORDS: Silicon, Transmittance, Semiconducting wafers, Infrared sensors, Sensors, Absorption, Oxygen, Packaging, Microelectromechanical systems, Germanium

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Proceedings Article | 31 May 2012 Paper

Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure

Taehyun Kim, Kimyung Kyung, Jae Hong Park, Young Su Kim, Sung Kyu Lim, Kyungmin Kim, Kwyro Lee, C. Welham, Hee Yeoun Kim

Proceedings Volume 8353, 83531B (2012) https://doi.org/10.1117/12.918916

KEYWORDS: Microbolometers, Readout integrated circuits, Sensors, Thermography, Resistance, Capacitance, Semiconducting wafers, Materials processing, Amorphous silicon, Infrared imaging

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