Mr. Takuei Nishio Profile

Takuei Nishio

at Ricoh Co Ltd

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Proceedings Article | 22 March 2019 Paper

Improved efficiency for processing transparent materials by using double-pulse explosion drilling

Asato Tamura, Takuei Nishio, Hiroyuki Suhara, Norio Nagayama

Proceedings Volume 10906, 109061N (2019) https://doi.org/10.1117/12.2508116

KEYWORDS: Glasses, Laser processing, Pulsed laser operation, Picosecond phenomena, Plasma, Laser drilling, Absorption, Silicon carbide, Laser damage threshold, Photonic devices

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Recent years have seen an increase in the demand of laser processing of transparent materials because of the numerous applications, such as the formation of through-silicon vias, glass scribing, the creation of optical wave guides, and so on. Furthermore, laser processing is expected to be used for fabricating photonic devices and circuits. Although significant research efforts have focused on laser processing of transparent materials, many unexplained mechanisms remain to be elucidated. In particular, mechanisms that remain unclear include plasma absorption and the process whereby traces expand when using double pulses. In 2017, to improve the laser-processing speed and efficiency, we proposed a method for cutting transparent materials called the “double-pulse explosion drilling method,” which uses two laser pulses of differing wavelengths to create internal modifications in a material. In the present study, we use the double-pulse method to drill through transparent materials and investigate how the second pulse affects laser-beam absorption and the generation of processing traces. We used a picosecond laser with pulses at 532 and 1064 nm for the first and second pulse, respectively. The target material was fused silica glass. The results clarify how the use of double pulses improves the processing efficiency. This presentation gives the experimental results and discusses the processing mechanisms at work in the double-pulse method.

Proceedings Article | 19 February 2018 Presentation + Paper

Double pulse explosion drilling of transparent materials

A. Tamura, T. Nishio, H. Suhara, N. Nagayama

Proceedings Volume 10520, 105200M (2018) https://doi.org/10.1117/12.2287648

KEYWORDS: Silica, Absorption, Laser processing, Glasses, Image processing, Pulsed laser operation, Laser ablation, Laser drilling, Ionization, Laser damage threshold

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We show the effects of double pulse processing with a pico-second laser for internal modification of transparent materials. In recent years, the need for laser processing of transparent materials has been growing. Many applications for such laser processing exist, such as the formation of through-silicon via, scribing glass and creating optical wave guides. Creation of photonic devices and circuits are also expected. A large amount of applied research on the processing of transparent materials has been conducted, but many of the processing mechanisms remain unexplained. In general, fluence thresholds are related to free-electron density caused by multi-photon ionization and avalanche ionization. Additionally, the internal fluence threshold of transparent materials is lower than surface fluence thresholds. We applied the double pulse method to the internal modification of transparent materials, and investigated how the second pulse affects the generation of microcracks. We used a pico-second laser with a 532-nm wavelength for the first pulse and a 1064-nm wavelength for the second pulse. The target was fused silica glass. In this paper, we show our experimental results and discuss the processing mechanism of the double pulse method. We call it the double pulse explosion drilling method. Moreover, we discover a processing method that can be applied to the high-rate drilling and scribing of transparent materials.

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