Prof. Thomas Ortlepp Profile

Prof. Thomas Ortlepp

at CiS Research Institute for Microsensor Systems

SPIE Involvement:

Author

Publications (20)

Proceedings Article | 13 March 2024 Presentation

Engineering silicon detectors with high quantum efficiency for low energy electrons

Kevin Lauer, Stephanie Reiss, Andreas Frank, Thomas Klein, Erik Hiller, Thomas Ortlepp, Toni Schildhauer

Proceedings Volume PC12912, PC129122O (2024) https://doi.org/10.1117/12.2692482

KEYWORDS: Electrons, Silicon, Quantum efficiency, Windows, Engineering, Quantum simulation, Quantum processes, Scanning electron microscopy, Quantum detection, Software development

Read Abstract +

Proceedings Article | 13 March 2024 Presentation

Pushing the understanding of quantum defects in silicon ahead to tailor quantum sensing by low-gain avalanche detectors

Kevin Lauer, Stephanie Reiss, Andreas Frank, Aaron Flötotto, Katharina Peh, Dominik Bratek, Robin Müller, Dirk Schulze, Stefan Krischok, Wichard Beenken, Erich Runge, Erik Hiller, Thomas Ortlepp, Andreas Winzer

Proceedings Volume PC12912, PC129121S (2024) https://doi.org/10.1117/12.2691654

KEYWORDS: Silicon, Quantum sensing, Quantum phenomena, Quantum detection, Chemical species, Boron, Ultrafast phenomena, Quantum systems, Luminescence, Thallium

Read Abstract +

Proceedings Article | 13 March 2024 Presentation

Quantum precise bias supply of superconducting single photon detectors

Thomas Ortlepp, Sonja Engert, Christian Moeller, Anna Reinhardt

Proceedings Volume PC12911, PC1291105 (2024) https://doi.org/10.1117/12.3003646

KEYWORDS: Single photon detectors, Resistors, Superconductors, Inductance, Quantum frequencies, Quantum experiments, Nanowires, Thin films, Superconductivity, Resistor arrays

Read Abstract +

Proceedings Article | 9 March 2022 Presentation

UVC LEDs: increase in optical performance through an optimized potting material

Indira Kaepplinger, Toni Schildhauer, Dennis Mitrenga, Guido Leibeling, Martin Schädel, Thomas Ortlepp

Proceedings Volume PC12022, PC120220E (2022) https://doi.org/10.1117/12.2609826

KEYWORDS: Light emitting diodes, Refractive index, Reflection, Optical testing, Metrology, Mercury, Medical devices, Lamps

Read Abstract +

Proceedings Article | 5 March 2021 Presentation

Factors influencing the emission characteristics of UV LED chips: The modular system for module optimization

Indira Kaepplinger, Dennis Mitrenga, Guido Leibeling, Frank Gindele, Yoshio Kikuchi, Olaf Brodersen, Thomas Ortlepp

Proceedings Volume 11706, 117060J (2021) https://doi.org/10.1117/12.2575072

KEYWORDS: Ultraviolet light emitting diodes, Ultraviolet radiation, Light emitting diodes, Thermography, UV optics, Optical components, Deep ultraviolet, Water, Medical diagnostics, Medical devices

Read Abstract +

Proceedings Article | 5 March 2021 Presentation

Integrated digitally adjustable step-down converter to control one individual or a series of UV-LED(s)

Olaf Brodersen, Konstantin Schmid, Christoph Heinze, Thomas Ortlepp, Peter Rotsch

Proceedings Volume 11706, 117060K (2021) https://doi.org/10.1117/12.2576789

KEYWORDS: Switches, Integrated circuits, Ultraviolet radiation, Temperature metrology, Synthetic aperture radar, Switching, Power supplies, Optical testing, Modulators, Medical equipment

Read Abstract +

Proceedings Article | 10 March 2020 Presentation

Miniaturization of the Hanbury Brown-Twiss configuration (Conference Presentation)

Martin Jahn, Dominik Karolewski, Julia Baldauf, Geert Brokmann, Thomas Ortlepp

Proceedings Volume 11293, 112930J (2020) https://doi.org/10.1117/12.2545667

KEYWORDS: Beam splitters, Avalanche photodetectors, Scattering, Quantum cryptography, Single photon, Avalanche photodiodes, Phase shifting, Optical simulations, Laser scattering, Silicon

Read Abstract +

Proceedings Article | 2 March 2020 Presentation + Paper

Advanced broadband MEMS infrared emitter based on high-temperature-resistant nanostructured surfaces and packaging solutions for harsh environments

S. Biermann, A. Magi, P. Sachse, M. Hoffmann, K. Wedrich, L. Müller, R. Koppert, T. Ortlepp, J. Baldauf

Proceedings Volume 11279, 1127908 (2020) https://doi.org/10.1117/12.2545119

KEYWORDS: Silicon, Infrared radiation, Microelectromechanical systems, Platinum, Gases, Packaging, Temperature metrology, Gas sensors, Resistance, Modulation, Black bodies, Photometry, Infrared detection, Infrared spectroscopy, Infrared technology

Read Abstract +

Proceedings Article | 28 February 2020 Presentation + Paper

Chip level fiber coupling

Ch. Möller, H.-G. Ortlepp, I. Käpplinger, K. Neckermann, T. Ortlepp

Proceedings Volume 11286, 1128614 (2020) https://doi.org/10.1117/12.2543020

KEYWORDS: Sensors, Fiber couplers, Optical fibers, Silicon, Photodiodes, Fiber Bragg gratings, Semiconducting wafers, Fiber optics sensors, Superconductors, Single photon detectors

Read Abstract +

Proceedings Article | 28 February 2020 Paper

Molybdenum silicide in infrared emitting devices

Julia Baldauf, Rüdiger Schmidt-Grund, Manfred Reiche, Thomas Ortlepp

Proceedings Volume 11293, 112930Y (2020) https://doi.org/10.1117/12.2556681

KEYWORDS: Molybdenum, Absorption, Photonic crystals, Infrared radiation, Optical properties, Thin films

Read Abstract +

Proceedings Article | 1 March 2019 Presentation + Paper

Discussion on reliability issues for UVB and UVC LEDs

S. Nieland, M. Weizman, D. Mitrenga, P. Rotsch, M. Schaedel, O. Brodersen, T. Ortlepp

Proceedings Volume 10940, 1094009 (2019) https://doi.org/10.1117/12.2509418

KEYWORDS: Light emitting diodes, Ultraviolet light emitting diodes, Ultraviolet radiation, Reliability, Silver, Strontium, Skin, Manufacturing, Gold, UV optics

Read Abstract +

The usage of UV LEDs is getting attractive for application such as phototherapy, plant growth, and disinfection due to the wavelength selective, narrow-band emission and a high potential for miniaturization of LED devices. Besides these benefits, the demands on optical power and long-term stability for these applications can often be well satisfied. For UVB LEDs most promising applications are in the field of medical skin therapy and novel concepts of horticulture and plant growth (irradiation of plants for the generation of phytamines or to reduce hormone-like mixtures). UVC applications focus on disinfection of air, surfaces and water at 265 nm or 280 nm. Each application field requires an individual UV dose, which is connected with the optical power output of the LED, and thus the number of LEDs and their long term stability. Typical doses for skin irradiation is 20 mJ/cm² at 310 nm and for water disinfection 20-60 mJ/cm² at 280 nm depending which target reduction factor log reduction of germicides is required. In this work a discussion on different factors influencing the reliability of LED modules, summarizing several years of research in this field will be given. Degradation effects are shown depending on LED design itself as well as the device assembly architecture including different mounting techniques. The most promising assembly technique was tested by a sample series of twice 400 single LED packages with a total yield of 87.7 % after mounting of UVB LEDs in single LED cases, cascading to an array on a main board by secondary soldering and burn-in of 48 hour at 50mA. In total 4% of the yield loss results by soldering issues of the LED on submount as well as another 8 % yield loss was measured after cascading of single LED packages on main board. Due to the burn-in process additional twenty UVB LEDs were lost. These reliability issues will be discussed using selected “state-of-the-art” LED device structures and examples of testing these LED devices in UV lighting lamp systems built at OSA opto Light will be given.

Proceedings Article | 1 March 2019 Paper

An innovative Si package for high-performance UV LEDs

Indira Kaepplinger, Robert Taeschner, Dennis Mitrenga, Dominik Karolewski, Long Li, Christian Meier, Martin Schaedel, Thomas Ortlepp

Proceedings Volume 10940, 109400A (2019) https://doi.org/10.1117/12.2509395

KEYWORDS: Light emitting diodes, Silicon, Semiconducting wafers, Reflectors, Fresnel lenses, Aluminum, Diodes, Ultraviolet light emitting diodes, Resistance, Quartz

Read Abstract +

Proceedings Article | 1 March 2019 Paper

Enhanced heat dissipation for high-power UV LED devices using sintering

S. Nieland, D. Mitrenga, O. Brodersen, M. Schaedel, T. Ortlepp

Proceedings Volume 10940, 109401V (2019) https://doi.org/10.1117/12.2509438

KEYWORDS: Light emitting diodes, Silver, Ultraviolet light emitting diodes, Gold, Ultraviolet radiation, Resistance, Scanning electron microscopy, Thermography, Reliability, Polymers

Read Abstract +

Higher optical power and higher UV doses come along with a higher operation temperature of UV LED based light sources. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device and enabling higher heat dissipation. Due to the design of UV LEDs, they have to be connected to a heat spreading submount by flip chip joining. Well established processes are flip chip soldering and thermal compression bonding. However, both methods do not achieve optimal heat dissipation in practice. Solder joining material offers a thermal conductivity in the range of 50-60 W/mK which can be further reduced by voids or uncovered areas. Gold contacts for thermal compression bonding offer excellent thermal conductivity of 320 W/mK, but show a maximum coverage of 50- 70%. Silver sinter paste adapted to the UV LED contact system, is a promising alternative flip chip joining material. In order to evaluate different joining methods, UV LED devices were assembled by thermal compression bonding, diffusion bonding, soldering and sintering and compared according to, thermal resistivity, optical-electrical and mechanical behavior and reliability issues. In addition, different silver sinter pastes were tested and their thermal resistivity was adjusted via processing parameters (pressurization, sintering temperature and time). For pressureless approaches the thermal conductivity and layer thickness are in the range of solder material or below. Using pressure for sintering, several advantages will be introduced. The interconnection thickness can be adjusted to be as thin as possible (below 5 micron), which enhanced the heat dissipation. A thin sintered layer of a few microns shows a lower shrinkage and a better adhesion to the joining partners. The thermal conductivity can be enhanced as well. After sintering, the silver interconnection layer is thermally stable up to 800 °C. These facts speak for sintering pastes as a real alternative for UV LED assembly.

Proceedings Article | 9 May 2018 Presentation + Paper

DNA analysis with UV-LEDs

Ch. Möller, M. Hentschel, Th. Hensel, A. Müller, Ch. Heinze, O. Brodersen, Th. Ortlepp

Proceedings Volume 10680, 1068013 (2018) https://doi.org/10.1117/12.2306761

KEYWORDS: Light emitting diodes, Ultraviolet radiation, Photodiodes, Fiber couplers, Absorption, Silicon, Diodes, Optical filters, UV optics, Analytical research

Read Abstract +

Proceedings Article | 9 May 2018 Presentation + Paper

Fast fluorescence lifetime determination with an ASIC detector unit

Ch. Möller, V. Körner, R. Matthes, Ch. Heinze, H.-G. Ortlepp, W. Altermann, T. Schildbach, M. Winkler, D. Buchweitz, M. Götz, T. Ortlepp

Proceedings Volume 10680, 1068009 (2018) https://doi.org/10.1117/12.2306752

KEYWORDS: Luminescence, Light emitting diodes, Diodes, Ultraviolet radiation, Sensors, Time metrology, Photodiodes, Computer aided design, Optical filters, Picosecond phenomena

Read Abstract +

Proceedings Article | 22 February 2018 Presentation + Paper

Fluorescence lifetime determination by miniaturized LED ns-pulser and ASIC detector unit

Ch. Möller, V. Körner, Ch. Heinze, H.-G. Ortlepp, R. Matthes, W. Altermann, T. Schildbach, M. Winkler, D. Buchweitz, M. Götz, T. Ortlepp

Proceedings Volume 10545, 105450K (2018) https://doi.org/10.1117/12.2287747

KEYWORDS: Luminescence, Light emitting diodes, Sensors, Time metrology, Computer aided design, Optical filters, Picosecond phenomena, Light sources and illumination, Lenses, Photomultipliers

Read Abstract +

Proceedings Article | 15 February 2018 Paper

Thermocompression bonding for high-power-UV LEDs

Indira Kaepplinger, Dominik Karolewski, Geert Brockmann, Thomas Ortlepp, Olaf Brodersen, Andreas Thies, Jens Rass, Sven Einfeldt, Neysha Lobo-Ploch, Christoph Stoelmacker, Frank Schnieder

Proceedings Volume 10554, 105541B (2018) https://doi.org/10.1117/12.2287720

KEYWORDS: Light emitting diodes, Ultraviolet radiation, Copper, Metals

Read Abstract +

Proceedings Article | 29 January 2018 Presentation + Paper

Advanced chip package of a fiber-coupled superconducting single-photon detector for a closed-cycle cryostat

Ch. Möller, K. Neckermann, M. Kermann, T. Ortlepp

Proceedings Volume 10561, 105610F (2018) https://doi.org/10.1117/12.2287785

KEYWORDS: Superconductors, Optical fibers, Semiconducting wafers, Sensors, Silicon, Single photon detectors, Superconducting detectors, Optical fabrication, Aluminum, Fiber couplers

Read Abstract +

Proceedings Article | 1 December 2017 Paper

Camera-based micro interferometer for distance sensing

Matthias Will, Martin Schädel, Thomas Ortlepp

Proceedings Volume 10603, 106030A (2017) https://doi.org/10.1117/12.2292769

Read Abstract +

Proceedings Article | 16 February 2017 Presentation + Paper

Influence of interconnection on the long-term reliability of UV LED packages

S. Nieland, D. Mitrenga, D. Karolewski, O. Brodersen, T. Ortlepp

Proceedings Volume 10124, 101240S (2017) https://doi.org/10.1117/12.2250289

KEYWORDS: Light emitting diodes, Reliability, Lamps, Ultraviolet light emitting diodes, Ultraviolet radiation, Gold, Aluminum nitride, Ceramics, Thermography, Power supplies

Read Abstract +

Showing 5 of 20 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years