The integration of active devices such as lasers, modulators or photodetectors on silicon photonics platforms has enabled the development of efficient, performant, low-cost and scalable high-speed integrated transceivers for optical communications. In this invited contribution, we will review the most relevant work in the field so far and we will present our recent progress on high-speed integrated transceivers for silicon photonics. The most relevant figures of merit for integrated lasers and electro-absorption modulators for high-speed optical communications will be discussed, as well as our vision for future developments.
We will present our design strategies adopted to boost the performance of heterogeneously integrated III-V-on-Si quantum well lasers for optical communications. For that, we will revisit our recent work on the co-integration of dual-ring widely tunable lasers with semiconductor optical amplifiers on a silicon photonic platform. Also, we will present a nanosecond-tunable capacitive III-V-on-Si distributed feedback laser able to continuously tune its emission wavelength over a 10 GHz span in only 2 ns. Finally, we will show our latest results on low-k distributed feedback lasers with backside sample gratings, showing a high output power and a low laser linewidth.
We review our work on integrated lasers for optical communications. An InP-based multilayer stack containing Al-based quantum wells with optical gain in the telecom window is bonded onto a silicon-on-insulator wafer with patterned photonic circuits and cavities. Ring-based widely tunable lasers and narrow linewidth DFB lasers are demonstrated.
Heterogeneous integration of III-V on silicon lasers eliminates some constraints of chip-to-chip alignment, but the optical coupling between the two media remains of importance for repeatable performances. First, we present a processing enhancement of the bonding oxide thickness uniformity across the wafer, improving the cross-section reproducibility. Next optimized tapering of the III-V/Si waveguides, offering a design agnostic to the number of quantum wells, will be shown. Finally, the yield of III-V on Silicon tunable lasers was evaluated by mean of wafer level measurements, using a yield oriented tuning of each cavity, so that lasers characteristics can be fairly compared.
In the frame of the H2020 PICTURE project, we designed and developed densely integrated photonic devices and transceiver (TRx) circuits for high bit-rate telecom and datacom applications. We implemented a process with four different InP-based dies bonded on SOI wafers. With one sole back-end processing run, we achieved the fabrication of multiple components of the complex TRx circuits, and many building block devices, such as III-V/Si SOAs & Fabry-Perot lasers, photodiodes or fast tunable capacitive DFB lasers. First testing of these devices shows promising results. 13dBm-saturation power SOAs and less than 2ns-tuning time capacitive DFB lasers were fabricated and demonstrated.
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