Articles

Heat transfer improvement in quasi-monolithic integration technology

[+] Author Affiliations
Mojtaba Joodaki

ATMEL Germany GmbH, Thresien Str. 2, P.O. Box 3535, 74025 Heilbronn, Germany

Günter Kompa

Kassel University, Department of High Frequency Engineering, Wilhelmshöher Allee 73, 34121 Kassel, Germany

Hartmut Hillmer

Kassel University, Department of Technological Electronics, Institute of Microstructure Technologies and Analytics, Heinrich-Plett Str. 40 (IMA), 34132 Kassel, Germany

Rainer Kassing

Kassel University, Department of Technological Electronics, Heinrich-Plett Str. 40 (IMA), 34132 Kassel, Germany

J. Micro/Nanolith. MEMS MOEMS. 4(3), 033011 (August 16, 2005). doi:10.1117/1.2008968
History: Received February 16, 2004; Revised February 03, 2005; Accepted February 04, 2005; Published August 16, 2005
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Static thermal analyses for the earlier concept and the enhanced quasi-monolithic integration technology (QMIT) are performed in detail. The effects of several parameters such as the properties of the materials involved and different geometries in all possible structures are described. Simulation results confirm a very low thermal resistance for the enhanced QMIT structure and highlight its superiority to the earlier concept of QMIT structures. This leads to a longer lifetime, a higher reliability and a better performance of the packaging.

© 2005 Society of Photo-Optical Instrumentation Engineers

Citation

Mojtaba Joodaki ; Günter Kompa ; Hartmut Hillmer and Rainer Kassing
"Heat transfer improvement in quasi-monolithic integration technology", J. Micro/Nanolith. MEMS MOEMS. 4(3), 033011 (August 16, 2005). ; http://dx.doi.org/10.1117/1.2008968


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