Articles

Cost-driven mask strategies considering parametric yield, defectivity, and production volume

[+] Author Affiliations
Kwangok Jeong

University of California at San Diego, Electrical and Computer Engineering Department, La Jolla, California 92093

Andrew B. Kahng

University of California at San Diego, Electrical and Computer Engineering Department and Computer Science and Engineering Department, La Jolla, California 92093

Christopher J. Progler

Photronics, Inc., Austin, Texas 78728

J. Micro/Nanolith. MEMS MOEMS. 10(3), 033021 (October 03, 2011). doi:10.1117/1.3633246
History: Received May 26, 2011; Revised July 30, 2011; Accepted August 15, 2011; Published October 03, 2011; Online October 03, 2011
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We provide new yield-aware mask strategies to mitigate emerging variability and defectivity challenges. To address variability, we analyze critical dimension variability with respect to reticle size and its impact on parametric yield. With a cost model that incorporates mask, wafer, and processing cost, considering throughput, yield, and manufacturing volume, we assess various reticle strategies (e.g., single-layer reticle, multiple-layer reticle, and small and large size) considering field-size–dependent parametric yield. To address defectivity, we compare parametric yield due to extreme ultraviolet mask blank defects for various reticle strategies in conjunction with reticle floorplan optimizations such as shifting of the mask pattern within a mask blank to avoid defects being superposed by performance-critical patterns of a design.

© 2011 Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation

Kwangok Jeong ; Andrew B. Kahng and Christopher J. Progler
"Cost-driven mask strategies considering parametric yield, defectivity, and production volume", J. Micro/Nanolith. MEMS MOEMS. 10(3), 033021 (October 03, 2011). ; http://dx.doi.org/10.1117/1.3633246


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