A variety of repairs were conducted on extreme ultraviolet (EUV) multilayer, including protection against pattern degradation in manufactural use, in order to evaluate feasibility of multilayer repair and subsequent protection schemes. The efficacy of postrepair protection techniques is evaluated to determine the lifetime of multilayer repairs. Simulations were used to select the optimal material thicknesses for repair protection, and the simulation results are verified with the lithographic results. The results showed a high correlation coefficient. Finally, all repaired sites were cleaned multiple times to quantify repair durability and impact on wafer critical dimension (CD). Aerial imaging of the repair sites before and after cleans showed a dramatic degradation of wafer CD. However, we show that applying a surface protection material after multilayer repair successfully mitigates the influence of multilayer degradation during extensive manufacturing operations.