Paper
1 August 1989 Soft Vacuum Pulsed Electron Beam Processing Of Tenon And Teflon-Like Films
J. Krishnaswamy, G. J. Collins, H. Hiraoka
Author Affiliations +
Abstract
Poly(tetrafluoroethylene), Teflon, is an excellent engineering material with a low dielectric constant, chemical. inertness in hazardous environments, and thermal stability. However, it has many shortcomings such as poor adhesion to substrates, difficulty in micron-sized via hole fabrication, and almost zero solubility in common solvents. We found that Teflon self-developed very efficiently under pulsed electron beam (25 KV to 30 KV) exposure in soft vacuum. Teflon images were obtained by performing the electron exposure through a mask. its etching rate is the highest among the polymer films studied including radiation-sensitive poly(2-butene sulfone). A possible mechanism for this high self-development rate is proposed.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Krishnaswamy, G. J. Collins, and H. Hiraoka "Soft Vacuum Pulsed Electron Beam Processing Of Tenon And Teflon-Like Films", Proc. SPIE 1089, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII, (1 August 1989); https://doi.org/10.1117/12.968539
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KEYWORDS
Electron beams

Etching

Polymers

Polymer thin films

Photomicroscopy

Photomasks

Scanning electron microscopy

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