Comparative study between wet and dry etching of silicon for microchannels fabrication

G. A. Cirino; L. A. M. Barea; R. D. Mansano; P. Verdonck; A. von Zuben; N. C. Frateschi; J. A. Diniz

doi:10.1117/12.2506804

4 March 2019 Comparative study between wet and dry etching of silicon for microchannels fabrication

G. A. Cirino, L. A. M. Barea, R. D. Mansano, P. Verdonck, A. von Zuben, N. C. Frateschi, J. A. Diniz

Proceedings Volume 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII; 1093015 (2019) https://doi.org/10.1117/12.2506804
Event: SPIE OPTO, 2019, San Francisco, California, United States

Abstract

In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 μm.

Citation Download Citation

G. A. Cirino, L. A. M. Barea, R. D. Mansano, P. Verdonck, A. von Zuben, N. C. Frateschi, and J. A. Diniz "Comparative study between wet and dry etching of silicon for microchannels fabrication", Proc. SPIE 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII, 1093015 (4 March 2019); https://doi.org/10.1117/12.2506804

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available