Presentation + Paper
1 December 2022 Benefits of SEM field-of-view contour averaging for contour-based MPC modeling
Kushlendra Mishra, Rachit Sharma, Ingo Bork, Zhiheng (Mary) Zuo, Mark Pereira, Samir Bhamidipati, Seshadri Rampoori
Author Affiliations +
Abstract
Building accurate models for Mask Process Correction (MPC) is indispensable for manufacturing masks for advanced wafer production nodes. In recent years, contour-based model calibration is being increasingly studied as a supplement to standard gauge-based modeling. In this paper, we demonstrate a data processing flow for contour calibration of MPC models to overcome the issue of noisy input contours by averaging the measured contours of repeating patterns within the SEM image field-of-view (FOV). This method not only averages out the statistical noise in the incoming FOV contours, but also allows us to make the model calibration process more efficient.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kushlendra Mishra, Rachit Sharma, Ingo Bork, Zhiheng (Mary) Zuo, Mark Pereira, Samir Bhamidipati, and Seshadri Rampoori "Benefits of SEM field-of-view contour averaging for contour-based MPC modeling", Proc. SPIE 12293, Photomask Technology 2022, 122930H (1 December 2022); https://doi.org/10.1117/12.2641833
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KEYWORDS
Calibration

Scanning electron microscopy

Photomasks

Signal to noise ratio

Statistical modeling

Metrology

Critical dimension metrology

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