Invar electrodeposition for MEMS application

Toshiki Hirano; Long-Sheng Fan

doi:10.1117/12.251214

23 September 1996 Invar electrodeposition for MEMS application

Toshiki Hirano, Long-Sheng Fan

Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251214
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

Low thermal expansion metal such as Invar is suitable for MEMS application, where the dimension stability requirement is very high over a wide temperature range. Invar electrodeposition process was developed as a method to fabricate Invar structure. The effect of plating parameters were investigated to develop optimized Invar deposition process. The Invar film obtained in this research has the thermal coefficient of expansion as low as 6.3 PPM/K, which is almost half of that of pure nickel. The process compatibility to the rest of MEMS fabrication process was proved through the prototyping of a microstructure.

Citation Download Citation

Toshiki Hirano and Long-Sheng Fan "Invar electrodeposition for MEMS application", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); https://doi.org/10.1117/12.251214

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