Paper
15 April 1997 Microelectromechanical force probe array
Scott A. Miller, Kimberly L. Turner, Noel C. MacDonald
Author Affiliations +
Abstract
The largest array (12 X 12) of microelectromechanical probe tips with integrated actuators and capacitive sensors for scanning probe microscopy has been designed, fabricated, and characterized. Each array element consists of a single crystal silicon tip on a torsional cantilever with out-of- plane interdigitated electrode capacitors. In addition, the size of each array element is about 150 micrometers by 150 micrometers with a tip-to-tip spacing in the array of 200 micrometers . Give these dimensions, the packing density of the devices is about 2500 units/cm2. The out-of-plane torsional design allows for significant improvement in performance (larger tip displacement and increased sense capacitance) and a higher density of devices per unit area as the minimum feature size decreases. Applications such as information storage, molecular manipulation, and nanolithography require high density, parallel arrays for reasonable throughput.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott A. Miller, Kimberly L. Turner, and Noel C. MacDonald "Microelectromechanical force probe array", Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); https://doi.org/10.1117/12.271215
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Cited by 1 scholarly publication.
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KEYWORDS
Electrodes

Capacitors

Capacitance

Silicon

Microelectromechanical systems

Crystals

Sensors

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