New mask having functions of OAI and PSM to realize sub-0.2-um patterns with 248 nm in microlithography

Xiangang Luo; HanMin Yao; Xunan Chen; Feng Boru

doi:10.1117/12.354391

26 July 1999 New mask having functions of OAI and PSM to realize sub-0.2-μm patterns with 248 nm in microlithography

Xiangang Luo, HanMin Yao, Xunan Chen, Feng Boru

Proceedings Volume 3679, Optical Microlithography XII; (1999) https://doi.org/10.1117/12.354391
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

New mask, which combines off-axis illumination using micro- profile and phase shift layer, is proposed. The physical mechanism of resolution and DOF enhancement of the mask is briefly discussed. Some results of simulation to investigate the basic lithographic characteristics of the mask are presented. Finally, experiments in i-line exposure systems have been carried out, and the result verified the enhancement of lithographic performance. In i-line exposure systems, we obtained best resolution of 0.30 micron and 2.34 micron DOF for 0.6 micron feature size. In our simulation, with 248 nm exposure wavelength, 0.16 micron pattern size can be realized with 2.0 micron DOF, and the proximity effect decreased obviously.

Citation Download Citation

Xiangang Luo, HanMin Yao, Xunan Chen, and Feng Boru "New mask having functions of OAI and PSM to realize sub-0.2-μm patterns with 248 nm in microlithography", Proc. SPIE 3679, Optical Microlithography XII, (26 July 1999); https://doi.org/10.1117/12.354391

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