Millennium maskmaking

Andrew C. Hourd

doi:10.1117/12.346875

28 April 1999 Millennium maskmaking

Andrew C. Hourd

Proceedings Volume 3741, Lithography for Semiconductor Manufacturing; (1999) https://doi.org/10.1117/12.346875
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

The rate of change within the microelectronics industry is not only continuing but accelerating, driven by both technical and economic requirements. Nowhere is this more visible than in the requirements for smaller and smaller geometries. 1999 will see full production of devices using 0.18 micrometers technology in Europe with 0.15 micrometers being introduced during the first years of the new Millennium; both technologies being supported by 'existing' 248nm lithography. The advent of routine subwavelength wafer patterning brings a number of major challenges for mask makers. This paper reviews the changes in mask technologies, production techniques and attitudes which will have to be adopted by maskshops over the next twelve months to meet these very real demands within Europe as the Millennium arrives.

Citation Download Citation

Andrew C. Hourd "Millennium maskmaking", Proc. SPIE 3741, Lithography for Semiconductor Manufacturing, (28 April 1999); https://doi.org/10.1117/12.346875

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