Micromachined accelerometer based on electron tunneling

Yongjun Yang; Lijie Li; Yongqing Xu; Yanjun Zhao; Chun-Guang Liang; Tongli Wei

doi:10.1117/12.364473

29 September 1999 Micromachined accelerometer based on electron tunneling

Yongjun Yang, Lijie Li, Yongqing Xu, Yanjun Zhao, Chun-Guang Liang, Tongli Wei

Proceedings Volume 3891, Electronics and Structures for MEMS; (1999) https://doi.org/10.1117/12.364473
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

In this paper, a new micromachined tunneling accelerometer is described. Using the bulk-silicon fabrication technology and the silicon/glass electrostatic bonding process, a sandwich structure tunneling accelerometer has been fabricated and tested. In order to reduce the low frequency noise, the feedback circuit has been improved by adding oscillator and demodulator. The first prototype has a resolution of approximately 1e^-6g/ (root) Hz and can survive with at least 50g shocking.

Citation Download Citation

Yongjun Yang, Lijie Li, Yongqing Xu, Yanjun Zhao, Chun-Guang Liang, and Tongli Wei "Micromachined accelerometer based on electron tunneling", Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); https://doi.org/10.1117/12.364473

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