Novel process to fabricate 3D microstructures joined with microchannel for microfluidic application

Weisong Wang; Jackie Chen; Ji Fang

doi:10.1117/12.569836

8 December 2004 Novel process to fabricate 3D microstructures joined with microchannel for microfluidic application

Weisong Wang, Jackie Chen, Ji Fang

Proceedings Volume 5591, Lab-on-a-Chip: Platforms, Devices, and Applications; (2004) https://doi.org/10.1117/12.569836
Event: Optics East, 2004, Philadelphia, Pennsylvania, United States

Abstract

A novel process of casting the polydimethyl-siloxane (PDMS) microstructure with hybrid photoresists mold has been developed to fabricate the 3D microstructure. This new processing includes two parts: the 3D mother mold fabrication and PDMS casting processing. The 3D mother mold, which consists of the three-dimensional partial-spherical microstructure and micro channel, was successfully fabricated and characterized. The 3D micro structure and the micro channel of the mother mold, made of two different photosensitive materials, AZ100XT and SU8 photoresist respectively, are merged very smoothly at the joint area. A mother mold of a 2200-μm-diameter chamber with a 500-μm-width channel was presented in this paper. For the best precise dimensional control, we used this mother mold to fabricate the PDMS mold for PDMS casting processing. The surface average roughness of the final 3D structure is 30 nm. This novel processing provides a new technology for achieving smooth 3D chamber surface joined with microchannel. This new technology can be applied in various lab-on-a-chip and microfluidic devices such as micropump and microvalve for which the great sealing, no dead volume and high back pressure are critical requirements. In this paper, the design, fabrication process and surface profile characterizations of this processing are presented in details.

Citation Download Citation

Weisong Wang, Jackie Chen, and Ji Fang "Novel process to fabricate 3D microstructures joined with microchannel for microfluidic application", Proc. SPIE 5591, Lab-on-a-Chip: Platforms, Devices, and Applications, (8 December 2004); https://doi.org/10.1117/12.569836

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