Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

S. Langa; C. Drabe; C. Kunath; A. Dreyhaupt; H. Schenk

doi:10.1117/12.2003525

9 March 2013 Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

S. Langa, C. Drabe, C. Kunath, A. Dreyhaupt, H. Schenk

Proceedings Volume 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII; 86140F (2013) https://doi.org/10.1117/12.2003525
Event: SPIE MOEMS-MEMS, 2013, San Francisco, California, United States

Abstract

In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called “membrane method”. Persistence of the vacuum was proven. No getter materials were used for packaging.

Citation Download Citation

S. Langa, C. Drabe, C. Kunath, A. Dreyhaupt, and H. Schenk "Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods", Proc. SPIE 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII, 86140F (9 March 2013); https://doi.org/10.1117/12.2003525

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