Paper
6 April 2015 Novel EUV resist development for sub-14nm half pitch
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Abstract
Extreme ultraviolet (EUV) lithography has emerged as a promising candidate for the manufacturing of semiconductor devices at the sub-14nm half pitch lines and spaces (LS) pattern for 7 nm node and beyond. The success of EUV lithography for the high volume manufacturing of semiconductor devices depends on the availability of suitable resist with high resolution and sensitivity. It is well-known that the key challenge for EUV resist is the simultaneous requirement of ultrahigh resolution (R), low line edge roughness (L) and high sensitivity (S). In this paper, we investigated and developed new chemically amplified resist (CAR) materials to achieve sub-14 nm hp resolution. We found that both resolution and sensitivity were improved simultaneously by controlling acid diffusion length and efficiency of acid generation using novel PAG and sensitizer. EUV lithography evaluation results obtained for new CAR on Micro Exposure Tool (MET) and NXE3300 system are described and the fundamentals are discussed.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masafumi Hori, Takehiko Naruoka, Hisashi Nakagawa, Tomohisa Fujisawa, Takakazu Kimoto, Motohiro Shiratani, Tomoki Nagai, Ramakrishnan Ayothi, Yoshi Hishiro, Kenji Hoshiko, and Toru Kimura "Novel EUV resist development for sub-14nm half pitch", Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 94220P (6 April 2015); https://doi.org/10.1117/12.2085927
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Cited by 19 scholarly publications.
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KEYWORDS
Extreme ultraviolet

Extreme ultraviolet lithography

Diffusion

Line width roughness

Lithography

Chemical species

Chemically amplified resists

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