Test of an argon cusp plasma for tin LPP power scaling

Malcolm W. McGeoch

doi:10.1117/12.2085925

19 March 2015 Test of an argon cusp plasma for tin LPP power scaling

Malcolm W. McGeoch

Proceedings Volume 9422, Extreme Ultraviolet (EUV) Lithography VI; 942228 (2015) https://doi.org/10.1117/12.2085925
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

Scaling the power of the tin droplet laser-produced-plasma (LPP) extreme ultraviolet (EUV) source to 500W has eluded the industry after a decade of effort. In 2014 we proposed [2] a solution: placing the laser-plasma interaction region within an argon plasma in a magnetic cusp. This would serve to ionize tin atoms and guide them to a large area annular beam dump. We have since demonstrated the feasibility of this approach. We present first results from a full-scale test plasma at power levels relevant to the generation of at least 200W, showing both that the argon cusp plasma is very stable, and that its geometrical properties are ideal for the transport of exhaust power and tin to the beam dump.

Citation Download Citation

Malcolm W. McGeoch "Test of an argon cusp plasma for tin LPP power scaling", Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 942228 (19 March 2015); https://doi.org/10.1117/12.2085925

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