Paper
20 March 2015 Directed self-assembly process integration: fin patterning approaches and challenges
Safak Sayan, B. T. Chan, Taisir Marzook, Nadia Vandenbroeck, Efrain A. Sanchez, Roel Gronheid, Arjun Singh, Paulina R. Delgadillo
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Abstract
Directed Self Assembly (DSA) processes offer the promise of providing alternative ways to extend optical lithography cost-effectively for sub-10nm nodes and present itself as an alternative pitch division approach. As a result, DSA has gained increased momentum in recent years, as a means for extending optical lithography past its current limits. The availability of a DSA processing line can enable to further push the limits of 193nm immersion lithography and overcome some of the critical concerns for EUV lithography.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Safak Sayan, B. T. Chan, Taisir Marzook, Nadia Vandenbroeck, Efrain A. Sanchez, Roel Gronheid, Arjun Singh, and Paulina R. Delgadillo "Directed self-assembly process integration: fin patterning approaches and challenges", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250R (20 March 2015); https://doi.org/10.1117/12.2087318
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Cited by 2 scholarly publications.
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KEYWORDS
Directed self assembly

Semiconducting wafers

Optical lithography

Etching

Photomasks

Optical alignment

Scanning electron microscopy

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