Paper
15 March 2016 Next-generation immersion scanner optimizing on-product performance for 7nm node
Yasushi Yoda, Akira Hayakawa, Satoshi Ishiyama, Yasuhiro Ohmura, Issei Fujimoto, Toru Hirayama, Yuji Shiba, Kazuo Masaki, Yuichi Shibazaki
Author Affiliations +
Abstract
The semiconductor technology roadmap suggests that multiple patterning techniques will be used at the 7nm node. The final lithography accuracy is determined by what is known as the "on-product" performance, which includes projection lens heating, illumination condition variations, product wafer related errors, and long term stability. It is evident that on product performance improvement is imperative now, and will become even more crucial in coming years. Nikon has developed the next-generation lithography system focusing on optimizing the main factors impacting on product performance. In this paper, we will introduce the details of the next-generation Nikon scanner and provide supporting performance data.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yasushi Yoda, Akira Hayakawa, Satoshi Ishiyama, Yasuhiro Ohmura, Issei Fujimoto, Toru Hirayama, Yuji Shiba, Kazuo Masaki, and Yuichi Shibazaki "Next-generation immersion scanner optimizing on-product performance for 7nm node", Proc. SPIE 9780, Optical Microlithography XXIX, 978012 (15 March 2016); https://doi.org/10.1117/12.2218955
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Cited by 4 scholarly publications.
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KEYWORDS
Semiconducting wafers

Signal processing

Scanners

Optical alignment

Distortion

Light sources

Atrial fibrillation

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