Presentation + Paper
30 April 2023 Effects of photoacid generator decomposition on dissolution kinetics of poly(4-hydroxystyrene) in tetraalkylammonium hydroxide aqueous solutions
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Abstract
For the advancement of lithography, the resist materials and processes are the most critical issue in the microfabrication of semiconductors. Especially in the sub-20 nm half pitch resolution region, the development process of resist materials is of particular importance from the viewpoint of reducing the line width roughness (LWR) and stochastic defects. In this study, a quartz crystal microbalance (QCM) method was used to investigate the dissolution dynamics of poly(4-hydroxystyrene) (PHS) films containing triphenylphosnium-nonaflate (TPS-nf) in tetraalkylammonium hydroxide aqueous solutions. The comparison of dissolution dynamics in five different developer solutions with different alkyl chain lengths was done.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yutaro Iwashige, Yuko Tsutsui Ito, Takahiro Kozawa, Kazuo Sakamoto, and Makoto Muramatsu "Effects of photoacid generator decomposition on dissolution kinetics of poly(4-hydroxystyrene) in tetraalkylammonium hydroxide aqueous solutions", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124980I (30 April 2023); https://doi.org/10.1117/12.2658138
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KEYWORDS
Photoacid generators

Ultraviolet radiation

Stochastic processes

Line width roughness

Lithography

Materials processing

Photoresist processing

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