Phase, along with defect levels and CD, must be closely monitored on 45nm technology node masks. The final phase
shift of a mask is highly dependent on the ability of the etch tool to stop at precisely the correct depth. Developing etch
processes and endpoint recipes for successful phase shift processing depends on rapid and accurate measurement of etch
depth. In many mask shops, these measurements are made by either direct phase measurement tools or atomic force
microscopes (AFM). These tools have relatively low throughput. In the case of the direct phase measurement tool, the
large measurement spot size precludes the measurement of the small features most interesting to mask makers. A need
exists for a relatively fast measurement tool that can be applied to features <1μm in size.
As part of Oerlikon USA's continuous etch process improvement efforts, the etch depth measurement capabilities of a
scatterometry based metrology tool were explored. Phase shift masks (one EAPSM, one AAPSM) were created to act as
standards for our experiments. Regions of each mask were etched to various depths using an Oerlikon Mask Etcher
system, and then measured with both a commercial AFM and an n&k Technology 1700-RT scatterometry tool. Using
this data, recipes capable of measuring quartz trench features, partially-etched MoSi trench features, and bulk MoSi films
were developed on the n&k 1700-RT. Phase uniformity data taken from actual etch experiments will be provided, as
well as data showing the repeatability of each system, and a comparison of the relative measurement times.
Uniformity distribution of the corner rounding radius of curvature is investigated using reflectance- and transmittance-based
optical scatterometry. Arrays of square contact holes are measured at multiple locations on an ACI photomask
using a broadband spectrophotometer capable of collecting polarized reflectance (Rs and Rp) and polarized
transmittance (Ts and Tp) spectra in 190 - 1000 nm wavelength range in one-nanometer intervals. The measured spectra
are analyzed using two-dimensional Rigorous Coupled-Wave Analysis algorithm (2D RCWA) in conjunction with the
Forouhi-Bloomer dispersion relations for n and k. As a result of the analysis, the values of contact hole width and the
radius of curvature associated with the corner rounding are determined at every measurement location. The
measurements are presented as uniformity distribution maps and correlation plots, comparing the results with the values
obtained using a conventional CD-SEM.
For the first time, Rigorous Coupled-Wave Analysis (RCWA) is used for the analysis of both polarized broadband
reflectance and transmittance spectra with the purpose of measuring the degree of corner rounding in 2D contact holes.
The use of transmittance spectra proves to be advantageous for the characterization of the shape of the contact holes. In
contrast with the conventional reflectance-only techniques, transmittance measurements prove to be more sensitive to
the angstrom-level variations in the shape of the contact hole. Therefore, the new technique is capable of accurately
determining the degree of rounding of the contact hole corners and characterizing a variety of shapes - from perfectly
round to perfectly square. Additionally, the high intensity of the transmitted spectra improves the signal-to-noise ratio
and guarantees better repeatability of the results.
For the current study, 2D arrays of square contact holes with 800 nm pitch are measured on an After Clean Inspection
(ACI) phase-shift mask, using a spectrophotometer-based instrument capable of collecting four continuous spectra
during one measurement - two polarized reflectance spectra (Rs and Rp) and two polarized transmittance spectra (Ts and
Tp). The measured spectra are analyzed using the Forouhi-Bloomer dispersion equations, in conjunction with RCWA.
The method provides accurate and repeatable results for the degree of corner rounding of the square contact holes. In
addition, the method provides trench depth, critical dimensions, film thickness, and optical properties (n and k spectra
from 190 - 1000 nm) of phase-shift photomasks. The results of the measurements are represented as high-resolution
uniformity maps obtained for all the parameters mentioned above. The results show excellent correlation with
conventional CD metrology techniques.
For the first time, polarized broadband transmittance (T) plus reflectance (R) measurements, combined with
the Rigorous Coupled-Wave Analysis (RCWA) and the Forouhi-Bloomer dispersion equations for n and k,
were used to measure 2D trench dimensions. This is in contrast to traditional scatterometry, which is based
on reflectance-only measurements. T and R were measured from 190 to 1000 nm in one-nanometer intervals.
Inclusion of the transmittance measurements proved to be advantageous, because there is a greater sensitivity
of the T spectra to the sub-nanometer structural and/or material variations, which are difficult to detect with
R-only measurements. Furthermore, the intensity of T is much higher than the intensity of R, resulting in a
much improved signal-to-noise ratio, since intensity is proportional to number of photons reaching the
detector, which in turn is proportional to the signal. Thus, the higher the intensity, the higher the signal-to-noise,
and the better the repeatability and reproducibility of the results.
For the current study, 2D arrays of square and circular contact holes of various pitches were measured on an
After-Clean-Inspection (ACI) phase-shift mask, using a spectrophotometer-based instrument, capable of
collecting four continuous spectra during one measurement - two polarized reflectance spectra (Rs and Rp)
and two polarized transmittance spectra (Ts and Tp). The measured spectra were analyzed using the Forouhi-Bloomer dispersion equations, in conjunctions with RCWA algorithm, applied simultaneously to R and T polarized spectra. The method provided accurate and repeatable results for contact hole depths, critical dimensions film thicknesses and n and k spectra. High-resolution uniformity maps were obtained for all the parameters mentioned above.
A novel scatterometry method, based on broadband measurements of reflectance and transmittance spectra is presented. For the first time Rigorous Coupled Wave Analysis (RCWA) algorithm is applied to the analysis of the transmittance spectra for the determination of trench depths, critical dimensions, profiles, film thicknesses, and optical properties (n and k spectra from 190 - 1000 nm) of phase-shift photomasks.
It is shown that very small structural and/or material variations, which are difficult to detect with reflectance (R) only measurements, can be readily distinguished with transmittance (T) measurements.
For the current study, a spectrophotometer-based instrument (n&k R-T Scatterometer) was used, capable of collecting four continuous spectra during one measurement - two polarized reflectance spectra (Rs and Rp) and two polarized transmittance spectra (Ts and Tp). The light source of the spectrophotometer was equipped with a rotating polarizer, facilitating TE and TM polarizations of the measurement beam. The analysis was performed using Forouhi-Bloomer dispersion equations, in conjunctions with RCWA algorithm, applied simultaneously to reflectance and transmittance spectra. The method provided accurate and repeatable results of above stated parameters, for all materials present in the structure.
A linearity study based on this novel reflectance-transmittance scatterometry method, demonstrated excellent correlation with the target values and the conventional CD-SEM measurements and improved repeatability compared to the traditional reflectance-only measurements. The advantages of the method are high throughput, non-destructive nature of the measurements, and capability to measure a wider variety of structures pertinent to the photomask manufacturing process.
For the first time Rigorous Coupled Wave Analysis (RCWA) has been applied to the analysis of the transmittance spectra for the determination of critical dimension (CD) of phase-shift photomasks. The use of transmittance spectra proved to be instrumental in improving the sensitivity of the measurement to minor (sub-nanometer) changes in the width of the trench. We present a novel unique metrology solution based on the simultaneous measurement of broadband reflectance and transmittance, covering a wavelength range from 190 to 1000 nm, in one nanometer intervals. The analyses of both types of spectra are performed simultaneously, using Forouhi-Bloomer dispersion equations, in conjunctions with RCWA. The method provides accurate and repeatable results for critical dimensions, thickness, and optical properties (n and k spectra from 190 - 1000 nm) for all materials present in the structure. In the current study, the method described above was used to examine grating structures on ACI (After-Clean Inspection) phase-shift mask. The use of transmittance spectrum proved to be essential for the accurate measurement of the CD, since the transmittance spectrum is more sensitive to the change in line width, compared to the reflectance spectrum. The results were compared with the measurements taken on the same sample using conventional CD-SEM. The CD linearity study demonstrated excellent correlation with CD-SEM. The advantages of the optical reflectance and transmittance method are high throughput, non-destructive nature of the measurements and capability to measure a wider variety of structures pertinent to the photomask manufacturing process.
The fabrication of a production-worthy phase shift mask requires, among other things, excellent uniformity of critical dimensions (trench width and depth) and optical properties of the phase shift material (MoSi). Traditionally, CD-SEM has been the instrument of choice for the measurement of width; AFP (Atomic Force Profilometer) or conventional profilometer for the measurement of depth; and Interferometer for the measurement of phase shift and transmittance of the phase shift material. We present an innovative optical metrology solution based on broadband reflectometry, covering a wavelength range from 190 to 1000 nm, in one nanometer intervals. The analysis is performed using Forouhi-Bloomer dispersion equations, in conjunctions with Rigorous Coupled Wave Analysis (RCWA). The method provides accurate and repeatable results for critical dimensions, thickness, and optical properties (n and k spectra from 190 - 1000 nm) for all materials present in the structure. In the current study, the method described above was used to examine photomasks at two stages of mask manufacturing process: After Etch Inspection (AEI) and After Strip Inspection (ASI). The results were compared with the measurements taken on the same samples using conventional CD-SEM. Two comparison studies were conducted - global CD uniformity and CD linearity. The CD linearity study demonstrated excellent correlation between the values of grating line width obtained using this new optical reflectometry approach and a CD-SEM for the grating structures of two pitches (760 nm and 1120 nm). The global CD uniformity study revealed that this presented reflectometry method can be used to produce CD uniformity maps which demonstrate excellent correlation with the results obtained using a conventional CD-SEM. The advantages of the optical method are high throughput, non-destructive nature of the measurements and capability to measure a wider variety of structures pertinent to the photomask manufacturing process.
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