The capability of mounting a parallel-optical module onto a PCB through solder-reflow process contributes to reduce the
number of piece parts, simplify its assembly process, and minimize a foot print for both AOC and on-board applications.
We introduce solder-reflow-capable parallel-optical modules employing 1060-nm InGaAs/GaAs VCSEL which leads to
the advantages of realizing wider modulation bandwidth, longer transmission distance, and higher reliability. We
demonstrate 4-channel parallel optical link performance operated at a bit stream of 28 Gb/s 231-1 PRBS for each channel
and transmitted through a 50-m-core MMF beyond 500 m. We also introduce a new mounting technology of paralleloptical
module to realize maintaining good coupling and robust electrical connection during solder-reflow process
between an optical module and a polymer-waveguide-embedded PCB.
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