We have reported on the growth of single-crystal diamond and its application to radiation detectors. This time, we report on the measurement of an imager with a photon-charge counting read out integrated circuit (ROIC) connected to a single-crystal diamond. The single crystal diamond was 3.0 x 3.0mm x 0.5mm thick. The bump connection area of our test ROIC is a 3.2mm x 3.2mm area with 40 x 40 pixels pads with 80µm pitch. Silver-based bumps were formed on short-crystal diamond using a super inkjet printer and bumped to the ROIC using flip chip bonders.
The imaging experiment was conducted by irradiating X-rays at 90 kV and 0.2 mA at 30cm distance. The results showed that the X-ray transmission image with a clear contrast between the area shielded by 2 mm thick lead and the unshielded area was captured, demonstrating a prototype single-crystal diamond-type X-ray imager.
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