Ms. Xin Ye Profile

Xin Ye

at Beijing Institute of Technology

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Publications (2)

Proceedings Article | 23 August 2013 Paper

Design of an optical system with large depth of field using in the micro-assembly

Rong Li, Jun Chang, Zhi-jing Zhang, Xin Ye, Hai-jing Zheng

Proceedings Volume 8911, 89110N (2013) https://doi.org/10.1117/12.2034559

KEYWORDS: Microscopes, Optical design, Wavefronts, Imaging systems, Optical imaging, Zoom lenses, 3D image processing, Digital image processing, Microelectromechanical systems, Monochromatic aberrations

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Micro system currently is the mainstream of application and demand of the field of micro fabrication of civilian and national defense. Compared with the macro assembly, the requirements on location accuracy of the micro-assembly system are much higher. Usually the dimensions of the components of the micro-assembly are mostly between a few microns to several hundred microns. The general assembly precision requires for the sub-micron level. Micro system assembly is the bottleneck of micro fabrication currently. The optical stereo microscope used in the field of micro assembly technology can achieve high-resolution imaging, but the depth of field of the optical imaging system is too small. Thus it’s not conducive to the three-dimensional observation process of the micro-assembly. This paper summarizes the development of micro system assembly at home and abroad firstly. Based on the study of the core features of the technology, a program is proposed which uses wave front coding technology to increase the depth of field of the optical imaging system. In the wave front coding technology, by combining traditional optical design with digital image processing creatively, the depth of field can be greatly increased, moreover, all defocus-related aberrations, such as spherical aberration, chromatic aberration, astigmatism, Ptzvel(field) curvature, distortion, and other defocus induced by the error of assembling and temperature change, can be corrected or minimized. In this paper, based on the study of theory, a set of optical microscopy imaging system is designed. This system is designed and optimized by optical design software CODE V and ZEMAX. At last, the imaging results of the traditional optical stereo microscope and the optical stereo microscope applied wave front coding technology are compared. The results show that: the method has a practical operability and the phase plate obtained by optimized has a good effect on improving the imaging quality and increasing the depth of field.

Proceedings Article | 31 August 2009 Paper

Pose measurement method with six parameters for microassembly based on an optical micrometer

Xin Ye, Qiang Wang

Proceedings Volume 7382, 73823R (2009) https://doi.org/10.1117/12.830947

KEYWORDS: 3D metrology, Measurement devices, Scanning electron microscopy, Optical microscopes, Laser optics, Microscopes, Receivers, Manufacturing, Data processing, Visualization

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This paper presents a new pose measurement method of microminiature parts that is capable of transforming one dimension (1D) contour size obtained by optical micrometer to three dimension (3D) data with six parameters for microassembly. Pose measurement is one of the most important processes for microminiature parts' alignment and insertion in microassembly. During the past few years, researchers have developed their microassembly systems focusing on visual identification to obtain two or three dimension data with no more than three parameters. Scanning electronic microscope (SEM), optical microscope, and stereomicroscope are applied in their systems. However, as structures of microminiature parts become increasingly complex, six parameters to represent their position and orientation are specifically needed. Firstly, The pose measurement model is established based on the introduction of measuring objects and measuring principle of optical micrometer. The measuring objects are microminiature parts with complex 3D structure. Two groups of two dimension (2D) data are gathered at two different measurement positions. Then part pose with 6 parameters is calculated, including 3 position parameters of feature point of the part and 3 orientation parameters of the part axis. Secondly, pose measurement process for a small shaft, vertical orientation determination, and position parameters obtaining are presented. 2D data is gathered by scanning the generatrix of the part, and valid data is extracted and saved in arrays. A vertical orientation criterion is proposed to determine whether the part is parallel to the Z-axis of the coordinate. If not, 2D data will be fixed into a linear equation using least square algorithm. Then orientation parameters are calculated. Center of Part End (CPE) is selected as feature point of the part, and its position parameters are extracted form two group of 2D data. Finally, a fast pose measurement device is developed and representative experiments are carried out. Results show that the measurement method could obtain pose of complex 3D micro parts fast and accurately, and can meet the demand of microassembly system.

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