1 October 2003 Characterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS application
Di Gao, Muthu B.J. Wijesundara, Carlo Carraro, Roger T. Howe, Roya Maboudian
Author Affiliations +
Abstract
The residual strain of amorphous and polycrystalline SiC films deposited using a single precursor 1,3-disilabutane is characterized as a function of deposition temperature ranging from 700 to 850°C. SiC microstrain gauges and cantilever beam arrays fabricated by micromachining are employed to characterize directly the average residual strain and strain gradient. The residual strain of SiC films changes from compressive to tensile as the deposition temperature increases. The strain gradient is also found to depend on the deposition temperature, and can be adjusted between positive and negative values to fabricate flat, curling-up, and curling-down micromechanical structures.
©(2003) Society of Photo-Optical Instrumentation Engineers (SPIE)
Di Gao, Muthu B.J. Wijesundara, Carlo Carraro, Roger T. Howe, and Roya Maboudian "Characterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS application," Journal of Micro/Nanolithography, MEMS, and MOEMS 2(4), (1 October 2003). https://doi.org/10.1117/1.1610478
Published: 1 October 2003
Lens.org Logo
CITATIONS
Cited by 22 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon carbide

Microelectromechanical systems

Silicon

Scanning electron microscopy

Low pressure chemical vapor deposition

Chemical vapor deposition

Crystals

Back to Top