Articles

Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter

[+] Author Affiliations
Changchun Hsu

National Tsing Hua University, Power Mechanical Engineering Department, Hsinchu, Taiwan

Chingfu Tsou

Feng Chia University, Department of Automatic Control Engineering, Taichung, Taiwan

Weileun Fang

National Tsing Hua University, Power Mechanical Engineering Department, Hsinchu, Taiwan

J. Micro/Nanolith. MEMS MOEMS. 6(3), 033011 (September 21, 2007). doi:10.1117/1.2778431
History: Received October 06, 2006; Revised April 17, 2007; Accepted May 08, 2007; Published September 21, 2007
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It is convenient to characterize thin film material properties using commercially available nanoindentation systems. This study aims to discuss several considerations while determining the thin film elastic modulus by means of a microcantilever bending test using a commercial nanoindentation system. The measurement results are significantly improved after: 1. the indentation of the film during the test is considered and corrected, and 2. the boundary effects are considered in the model by finite element method. In application, the elastic modulus of electroplating nickel film 11μm thick was characterized.

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© 2007 Society of Photo-Optical Instrumentation Engineers

Topics

Thin films

Citation

Changchun Hsu ; Chingfu Tsou and Weileun Fang
"Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter", J. Micro/Nanolith. MEMS MOEMS. 6(3), 033011 (September 21, 2007). ; http://dx.doi.org/10.1117/1.2778431


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