Six DM die were packaged onto a 181-pin, gold-plated through-hole ceramic pin grid array (CPGA) (CPG18023, Spectrum Semiconductor Material, Inc, San Jose, California). The central actuators () were wire bonded to the CPGA. The outer two rows of the DM are used as spring supports for the continuous facesheet. For this particular packaging, the DMs were not hermetically sealed. A glass lid was attached to protect the mirrors from dust.