Micromachining for silicon microaccelerometer

Kunchinadka Narayana Hari Bhat

doi:10.1117/12.305558

16 April 1998 Micromachining for silicon microaccelerometer

Kunchinadka Narayana Hari Bhat

Proceedings Volume 3321, 1996 Symposium on Smart Materials, Structures, and MEMS; (1998) https://doi.org/10.1117/12.305558
Event: Smart Materials, Structures and MEMS, 1996, Bangalore, India

Abstract

In this paper, the concepts of `bulk' and `surface' micromachining are first presented. The fabrication techniques for realizing silicon microaccelerometer using these two approaches are next presented. In both the cases, the acceleration is measured by detecting the change in the capacitance due to the deflection of an inertial mass called seismic mass or proof mass with respect to fixed plates. The relative merits of the two approaches are presented to allow that in spite of the simplicity and low cost nature of bulk micromachining, the surface micromachining has gained popularity because of its versatility and suitability for integrating the surface micromachined sensors with the integrated circuits.

Citation Download Citation

Kunchinadka Narayana Hari Bhat "Micromachining for silicon microaccelerometer", Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); https://doi.org/10.1117/12.305558

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