Paper
30 December 2003 Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch
Marco Del Sarto, Simone Sassolini, Mauro Marchi, Lorenzo Baldo
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Abstract
This paper illustrates a novel MEMS technology that allows the creation of a multiple axis actuator / sensor trough deep silicon etching and wafer bonding techniques. As example a dual axis rotational high-stroke MEMS actuator is presented. This device can integrate a mirror to realize a device used, for example, in fully optical multiplexer. Microfabrication technology derives from our previous works and it’s based on deep silicon trench techniques as well as on wafer bonding capabilities. More over the resulting assembly after the wafer bonding is machined to proceed on realizing the complete MEMS device.
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Marco Del Sarto, Simone Sassolini, Mauro Marchi, and Lorenzo Baldo "Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); https://doi.org/10.1117/12.524722
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KEYWORDS
Actuators

Semiconducting wafers

Electrodes

Microelectromechanical systems

Mirrors

Wafer bonding

Silicon

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