Chin-Juan Li
at United Microelectronics Corp.
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 26 May 2022 Poster + Paper
Proceedings Volume 12053, 120531T (2022) https://doi.org/10.1117/12.2613620
KEYWORDS: Inspection, Semiconducting wafers, Wafer inspection, Image classification, Yield improvement, Defect inspection, Data analysis, Software development, Defect detection, Tolerancing

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