Directed self-assembly (DSA) of block copolymers (BCP) is considered a promising patterning approach for the 7-nm node and beyond. Specifically, a graphoepitaxy process using a cylindrical phase BCP may offer an efficient solution for patterning randomly distributed contact holes with subresolution pitches, such as found in via and cut mask levels. In any graphoepitaxy process, the pattern density impacts the template fill (local BCP thickness inside the template) and may cause defects due to over- or underfilling of the template. In order to tackle this issue thoroughly, the parameters that determine template fill and the influence of template fill on the resulting pattern should be investigated. Using three process flow variations (with different template surface energy), template fill is experimentally characterized as a function of pattern density and film thickness. The impact of these parameters on template fill is highly dependent on the process flow, and thus prepattern surface energy. Template fill has a considerable effect on the pattern transfer of the DSA contact holes into the underlying layer. Higher fill levels give rise to smaller contact holes and worse critical dimension uniformity. These results are important for DSA-aware design and show that fill is a crucial parameter in graphoepitaxy DSA.